Front-End electronics and integration of ATLAS pixel modules

Fabian Huegging

doi:10.1016/j.nima.2005.04.045

Front-End electronics and integration of ATLAS pixel modules

Instrumentation and Detectors 2008-11-26 v1

Authors: Fabian Huegging

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Abstract

For the ATLAS Pixel Detector fast readout electronics has been successfully developed and tested. Main attention was given to the ability to detect small charges in the order of 5,000 electrons within 25 ns in the harsh radiation environment of LHC together with the challenge to cope with the huge amount of data generated by the 80 millions channels of the Pixel detector. For the integration of the 50 micron pitch hybrid pixel detector reliable bump bonding techniques using either lead-tin or indium bumps has been developed and has been successfully tested for large scale production.

Keywords

lhc detector upgrades detector readout electronics particle detector

Cite

@article{arxiv.physics/0401106,
  title  = {Front-End electronics and integration of ATLAS pixel modules},
  author = {Fabian Huegging},
  journal= {arXiv preprint arXiv:physics/0401106},
  year   = {2008}
}

Comments

Talk at the VERTEX2003 conference, Lake Windermere, UK, September 2003, 8 pages, LaTeX, 6 eps figures

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