Related papers: Integration and Packaging
Future high-luminosity hadron collider experiments feature unprecedented levels of event pile-up and extreme radiation environments, calling for sensors capable of 4D tracking, even after significant radiation damage. To this purpose, 3D…
Detectors based on pixels with timing capabilities are gaining increasing importance in the last years. Next-to-come high-energy physics experiments at colliders require the use of time information in tracking, due to the expected levels of…
3D integration, i.e., stacking of integrated circuit layers using parallel or sequential processing is gaining rapid industry adoption with the slowdown of Moore's law scaling. 3D stacking promises potential gains in performance, power and…
For the next generation of mobile communications systems, the integration of sensing and communications promises benefits in terms of spectrum utilization, cost, latency, area and weight. In this paper, we categorize and summarize the key…
The demand for integrated photonic chips combining the generation and manipulation of quantum states of light is steadily increasing, driven by the need for compact and scalable platforms for quantum information technologies. While photonic…
Thin-film optical filters can nowadays be integrated onto pixels of commercial image sensors used for spectral imaging. A drawback of having more filters on an image sensor is a loss in spatial resolution which could be regained by using…
The physics aims at the proposed high-energy $e^+e^-$ collider CLIC pose challenging demands on the performance of the detector system. Precise hit-time tagging, an excellent spatial resolutions, and a low mass are required for the vertex…
Photonic integrated circuits (PIC) currently rely on application-specific designs that are geared towards a particular functionality. Development of such application-specific PIC requires considerable effort and often involves several…
Optical imaging technologies are central to discovery in the life and physical sciences, yet their impact depends on how readily they can be built, adapted, and sustained across laboratories. Digital fabrication, including desktop 3D…
Microelectronic integration is a key enabler for the ubiquitous deployment of devices in large volumes ranging from MEMS and imaging sensors to consumer electronics. Such integration has also been achieved in photonics, where compact…
As we have seen for digital camera market and a sensor resolution increasing to "megapixels", all the scientific and high-tech imagers (whatever the wave length - from radio to X-ray range) tends also to always increases the pixels number.…
The R&D activity presented is focused on the development of new modules for the upgrade of the ATLAS pixel system at the High Luminosity LHC (HL-LHC). The performance after irradiation of n-in-p pixel sensors of different active thicknesses…
Most previous 3D IC research focused on stacking traditional 2D silicon layers, so the interconnect reduction is limited to inter-block delays. In this paper, we propose techniques that enable efficient exploration of the 3D design space…
Photonic integrated circuits (PICs) enable miniaturization of optical quantum circuits because several optic and electronic functionalities can be added on the same chip. Single photon emitters (SPEs) are central building blocks for such…
Entanglement is a counterintuitive feature of quantum physics that is at the heart of quantum technology. High-dimensional quantum states offer unique advantages in various quantum information tasks. Integrated photonic chips have recently…
In this paper, we propose a novel 3D object detector that can exploit both LIDAR as well as cameras to perform very accurate localization. Towards this goal, we design an end-to-end learnable architecture that exploits continuous…
There are two critical sensors for 3D perception in autonomous driving, the camera and the LiDAR. The camera provides rich semantic information such as color, texture, and the LiDAR reflects the 3D shape and locations of surrounding…
Digitisation of natural history collections not only preserves precious information about biological diversity, it also enables us to share, analyse, annotate and compare specimens to gain new insights. High-resolution, full-colour 3D…
As designs for superconducting qubits become more complex, 3D integration of two or more vertically bonded chips will become necessary to enable increased density and connectivity. Precise control of the spacing between these chips is…
Nowadays, most structural integrity concepts rely on simplified isotropic ma-terial data that are used within continuum mechanics modeling approaches. In contrast, modern casting and forming processes yield complex microstruc-tures coming…