Related papers: High Density Through Silicon Via (TSV)
Laser micro-welding is an advanced manufacturing method today applied in various domains. However, important physical limitations have prevented so far to demonstrate its applicability in silicon and other technology-essential…
Ultra-thin crystal targets in shape of self-supporting membranes were produced for our experiments with parametric x-rays emitted by low-energy electrons. Concise description of the technology developed for production of silicon crystal…
We present design, fabrication and characterization of a MEMS VCSEL which utilizes a silicon-on-insulator wafer for the microelectromechanical system and encapsulates the MEMS by direct InP wafer bonding, which improves the protection and…
We describe a microfabrication process for superconducting through-silicon vias appropriate for use in superconducting qubit quantum processors. With a sloped-wall via geometry, we can use non-conformal metal deposition methods such as…
The vertical-cavity surface-emitting lasers (VCSELs) have emerged as a vital approach for realizing energy efficient, high speed optical interconnects in the data center and supercomputers. As of today, VCSEL is the most suitable for mass…
Silicon photonic devices fundamental to high-density wavelength-division multiplexed (DWDM) optical links and photonic switching networks, such as resonant modulators and Mach-Zehnder interferometers (MZIs), are highly sensitive to…
The implementation of terahertz (THz) wafer-level metadevices is critical to advance the science for applications including (I) integrated focal plane array which can image for biology and (II) integrated narrowband absorbers for high…
Applications such as augmented and virtual reality (AR/VR), optical atomic clocks, and quantum computing require photonic integration of (near-)visible laser sources to enable commercialization at scale. The heterogeneous integration of…
We describe a micro-fabrication method to create concave features with ultra-low surface roughness in silica, either on the end facets of optical fibers or on flat substrates. The machining uses a single focused CO2 laser pulse. Parameters…
Thermophotovoltaics (TPVs) have the potential to exhibit higher power conversion efficiencies than traditional photovoltaics (PVs), with a broad range of applicability from waste recovery systems to aerospace solutions. They operate by…
We propose an all-silicon multi-layer interference filter composed solely of silicon with sub-wavelength structure (SWS) in order to realize high performance optical filters operating in the THz frequency region with robustness against…
Developing a chip-based super-resolution imaging technique with large field-of-view (FOV), deep subwavelength resolution, and compatibility for both fluorescent and non-fluorescent samples is desired for material science, biomedicine, and…
We describe a process route to fabricate arrays of Ultra-low-Noise MoAu Transition Edge Sensors (TESs). The low thermal conductance required for space applications is achieved using 200 nm-thick Silicon Nitride (SiNx ) patterned to form…
This paper introduces an innovative approach to silicon and glass via inspection, which combines hybrid field microscopy with photometric stereo. Conventional optical microscopy techniques are generally limited to superficial inspections…
In three dimensional integrated circuits (3D-ICs), through silicon via (TSV) is a critical technique in providing vertical connections. However, the yield and reliability is one of the key obstacles to adopt the TSV based 3D-ICs technology…
Micro-Raman spectroscopy was employed to study the near-surface stress distributions and origins in Si around through silicon vias (TSVs) at both room temperature and elevated temperatures for Cu-filled and CNT-filled TSV samples. From the…
Threshold switching (TS) is a phenomenon where non-permanent changes in electrical resistance of a two-terminal device can be controlled by modulating the voltage bias. TS based on silver (Ag) conductive filaments has been observed in many…
Silicon-vacancy (SiV) color centers in diamond have great potential for optical sensing and bio-imaging applications. However, the fabrication of large-scale high-density SiV centers in diamond remains difficult. Here, we report a promising…
Scanning tunneling luminescence microscopy (STLM) along with scanning tunneling spectroscopy (STS) is applied to a step-bunched, oxidized 4H-SiC surface prepared on the silicon face of a commercial, n-type SiC wafer using a silicon melt…
The rapid growth of artificial intelligence (AI) and other data center applications is driving the demand for photonic interconnects that combine high-speed with low energy consumption, making scalability a critical requirement.…