Related papers: High Density Through Silicon Via (TSV)
Lack of materials which are thermoelectrically efficient and economically attractive is a challenge in thermoelectricity. Silicon could be a good thermoelectric material offering CMOS compatibility, harmlessness and cost reduction but it…
Thermally activated delayed fluorescence (TADF) offers the promise of highly efficient organic light emitting diodes (OLEDs), without the heavy metals requirement of the previous generation of OLEDs. However, the design of new TADF emitters…
At National Institute of Metrological Research (INRIM), a selectable-value Transportable High dcVoltage Standard (THVS) operating in the range from 10 V to 100 V in steps of 10 V, was developed. This Standard was built to cover the lack of…
Porous silicon layers (PS) have been prepared in this work via Photoelectrochemical etching process (PEC) of n type silicon wafer of 0.8 ohm.cm resistivity in hydrofluoric (HF) acid of 24.5 precent concentration at different etching times…
Recently, metasurfaces have gained popularity due to their ability to offer a spatially varying phase response, low intrinsic losses and high transmittance. Here, we demonstrate numerically and experimentally a silicon metasurface at THz…
Among several solutions to exploit solar energy, thermophotovoltaics (TPV) have been popularized and have known great breakthroughs during the past two decades. Yet, existing systems still have low efficiencies since the wavelength range of…
The co-packaging of optics and electronics provides a potential path forward to achieving beyond 50 Tbps top of rack switch packages. In a co-packaged design, the scaling of bandwidth, cost, and energy is governed by the number of optical…
High quality-factor (Q) dielectric metasurfaces operating in the visible to near-infrared range usually require sub-200 nm features, limiting their fabrication to expensive, low-throughput electron beam lithography. Here, we demonstrate…
Recent advances in three-dimensional laser writing have enabled direct nanostructuring deep within silicon, unlocking a volumetric design space previously inaccessible to surface-bound nanophotonic devices. Here, we introduce subwavelength…
We present the electro-thermal characterization of transition-edge sensor (TES) detectors suspended on Si membranes fabricated using a silicon-on-insulator (SOI) wafer. The use of an all-silicon fabrication platform, in contrast to the more…
Atomically thin, single-crystalline transition metal dichalcogenides (TMDCs) grown via chemical vapor deposition (CVD) on sapphire substrates exhibit exceptional mechanical and electrical properties, positioning them as excellent channel…
We report two novel fabrication techniques, as well as spectral transmission and propagation loss measurements of the subwavelength plastic wires with highly porous (up to 86%) and non-porous transverse geometries. The two fabrication…
The most direct definition of a patterning process' resolution is the smallest half-pitch feature it is capable of transferring onto the substrate. Here we demonstrate that thermal Scanning Probe Lithography (t-SPL) is capable of…
We present the results of the characterization of pixel modules composed of 75 um thick n-in-p sensors and ATLAS FE-I3 chips, interconnected with the SLID (Solid Liquid Inter-Diffusion) technology. This technique, developed at…
The rapid growth of artificial intelligence (AI) and data-centric computing is driving exabyte-scale data transfer, pushing conventional interconnect technologies toward fundamental bandwidth and energy limits. Although optical…
Sensors fabricated from high resistivity, float zone, silicon material have been the basis of vertex detectors and trackers for the last 30 years. The areas of these devices have increased from a few square cm to $\> 200\ m^2$ for the…
This paper describes a novel integrated circuit technology to manufacture high-density thermoelectric devices on a semiconductor wafer. With no moving parts, a thermoelectric cooler operates quietly, allows cooling below ambient…
The Quasi-Spectral Viscosity (QSV) method is a novel closure for a high-order finite-difference discretization of the filtered compressible Navier-Stokes equations capable of unifying dynamic sub-filter scale (SFS) modeling and shock…
Thermophotovoltaic (TPV) cells are increasingly attractive for applications in industrial waste heat harvesting, aerospace energy management, and compact power generation. Deploying midwave-infrared (MWIR) TPV in practical applications…
Micro-electro mechanical systems (MEMS) thermal flow sensors are increasingly used for compact, low-power flow monitoring in biomedical applications. However, silicon-based method for sensor fabrication is limited by high cost, rigidity,…