Related papers: High Density Through Silicon Via (TSV)
Vertical cavity surface emitting lasers (VCSELs) have made indispensable contributions to the development of modern optoelectronic technologies. However, arbitrary beam shaping of VCSELs within a compact system still remains inaccessible…
Thin membranes are highly sought-after for nanopore-based single-molecule sensing and fabrication of such membranes becomes challenging in the \lesssim10 nm thickness regime where a plethora of useful molecule information can be acquired by…
In this paper we present a novel fabrication technique for silicon nitride (Si3N4) waveguides with a thickness of up to 900 nm, which are suitable for nonlinear optical applications. The fabrication method is based on etching trenches in…
A novel microfabricated, all-electrical measurement platform is presented for a direct, accurate and rapid determination of the thermal conductivity and diffusivity of liquid and solid materials. The measurement approach is based on the…
A generic and universal layer engineering strategy for van der Waals (vW) materials, scalable and compatible with the current semiconductor technology is of paramout importance in realizing all-two-dimensional logic circuits and move beyond…
Microwave energy can be advantageously used for materials processing as it provides high heating rates and homogeneous temperature field distribution. These features are partly due to the large microwave penetration depth into dielectric…
Due to their nature, using shear thickening fluids (STFs) in engineering applications has sparked an interest in developing energy-dissipating systems, such as damping devices or shock absorbers. The Rheinforce technology allows the design…
The manufacturing cost of quantum cascade lasers is still a major bottleneck for the adoption of this technology for chemical sensing. The integration of Mid-Infrared sources on Si substrate based on CMOS technology paves the way for…
Although high-resistivity, low-loss silicon is an excellent material for THz transmission optics, its high refractive index necessitates antireflection treatment. We fabricated a wide-bandwidth, two-layer antireflection treatment by cutting…
Heterostructure materials form the basis of much of modern electronics, from transistors to lasers and light-emitting diodes. Recent years have seen a renewed focus on creating heterostructures through the vertical integration of…
The growing demand for more efficient data transmission has made nanoscale high-throughput all-optical switching a critical requirement in modern telecommunication systems. Metasurface-based platforms offer unique advantages because of…
Vision Transformers (ViTs) are pivotal for foundational models in scientific imagery, including Earth science applications, due to their capability to process large sequence lengths. While transformers for text has inspired scaling sequence…
VOXES is a Von Hamos X-ray spectrometer developed at the INFN National Laboratories of Frascati for high-resolution laboratory X-ray spectroscopy in the 5--20~keV range. It uses curved mosaic crystals and motorized positioning stages to…
We demonstrate a gate dielectric engineering approach leveraging an ultrathin, atomic layer deposited (ALD) silicon oxide interfacial layer (SiL) between the amorphous oxide semiconductor (AOS) channel and the high-k gate dielectric. SiL…
High-level synthesis (HLS) aims at democratizing custom hardware acceleration with highly abstracted software-like descriptions. However, efficient accelerators still require substantial low-level hardware optimizations, defeating the HLS…
We invented a novel method to fabricate graphene transistors on oxidized silicon wafers without the need to transfer graphene layers. By means of catalytic chemical vapor deposition (CCVD) the in-situ grown bilayer graphene transistors…
Development of optical links with 850 nm multi-mode vertical-cavity surface-emitting lasers (VCSELs) has advanced to 25 Gbps in speed. For applications in high-energy experiments, the transceivers are required to be tolerant in radiation…
Thermomechanical stress induced by through-silicon vias (TSVs) plays an important role in the performance and reliability analysis of 2.5D/3D ICs. While the finite element method (FEM) adopted by commercial software can provide accurate…
While distributed device-edge speculative decoding enhances resource utilization across heterogeneous nodes, its performance is often bottlenecked by conventional token-level verification strategies. Such rigid alignment leads to excessive…
We use Keck HIRES spectra of three intermediate redshift QSOs to study the physical state and kinematics of the individual components of CIV selected heavy element absorption systems. Fewer than 8 % of all CIV lines with column densities…