Related papers: High Density Through Silicon Via (TSV)
Active microelectromechanical systems can couple the nanomechanical domain with the electronic domain by integrating electronic sensing and actuation mechanisms into the micromechanical device. This enables very fast and sensitive…
This paper reports on an approach for fabrication of micro-channels with nanometer thickness achieved by optimization of UV lithography processes. Rectangular micro-channels with a staple edge are fabricated over the surface of a silicon…
High silicon steel with 6.5% silicon content is the best because of its excellent magnetic properties, such as high saturation magnetization, high resistivity, low iron loss and near zero magnetostriction. High silicon steel can greatly…
Silicon carbide (SiC) is an important semiconductor material for fabricating power electronic devices that exhibit higher switch frequency, lower energy loss and substantial reduction both in size and weight in comparison with its Si-based…
We present a guide for the design and fabrication of a CMOS-compatible metamaterial microstructure as an absorber of visible light with exceptionally high absorption efficiency (~ 98%), for wavelengths 400nm-700nm. The structural parameters…
V$_3$Si thin films are known to be superconducting with transition temperatures up to 15 K, depending on the annealing temperature and the properties of the substrate underneath. Here we investigate the film structural properties with the…
The need for a high-performance transceiver with high Signal to Noise Ratio (SNR) has driven the communication system to utilize the latest technique identified as oversampling systems. It was the most economical modulator and decimation in…
Titanium silicide is a key contact material in advanced three-dimensional semiconductor device architectures. Here, we examine the formation of ultrathin Ti-silicide on Si(100) using a combination of non-destructive in-situ and ex-situ ion…
Two-dimensional tungsten disulfide (WS2) is a promising semiconductor for next-generation optoelectronic and photovoltaic devices, but scalable routes to uniform, large-area films remain challenging. In this study, a systematic thermal…
Transition metal dichalcogenides (TMDs) are van der Waals layered materials with sizable and tunable bandgaps, offering promising platforms for two-dimensional electronics and optoelectronics. To this end, the bottleneck is how to acquire…
Recent advances in increasing the spectroscopic energy resolution in scanning tunneling microscopy (STM) have been achieved by integrating electron spin resonance (ESR) with STM. Here, we demonstrate the design and performance of a…
Porous materials possess numerous useful functions because of their high surface area and ability to modulate the transport of heat, mass, fluids, and electromagnetic waves. Unlike highly ordered structures, disordered porous structures…
Triple sum-frequency (TSF) spectroscopy is a recently-developed methodology that enables collection of multidimensional spectra by resonantly exciting multiple quantum coherences of vibrational and electronic states. This work reports the…
Mid-infrared spectroscopy offers powerful label-free molecular analysis capabilities but faces significant challenges when analyzing complex biological samples. Here, we present a transformative surface-enhanced infrared absorption…
We demonstrate a hybrid laser microfabrication approach, which combines the technical merits of ultrafast laser-assisted chemical etching and carbon dioxide laser-induced in-situ melting, for centimeter-scale and bonding-free fabrication of…
3D integration technologies are seeing widespread adoption in the semiconductor industry to offset the limitations and slowdown of two-dimensional scaling. High-density 3D integration techniques such as face-to-face wafer bonding with…
We demonstrate the first microchip semiconductor membrane external-cavity surface-emitting laser. This compact type of laser consists solely of a semiconductor gain region present as a micron-thin membrane, sandwiched between two…
Transmission Electron Microscopy (TEM) is a powerful tool for imaging material structure and characterizing material chemistry. Recent advances in data collection technology for TEM have enabled high-volume and high-resolution data…
The CDF experiment's Silicon Vertex Trigger is a system of 150 custom 9U VME boards that reconstructs axial tracks in the CDF silicon strip detector in a 15 microsecond pipeline. SVT's 35 micron impact parameter resolution enables CDF's…
Laser dicing of semiconductor wafers is a critical step in microelectronic manufacturing, where multiple sequential laser passes precisely separate individual dies from the wafer. Adapting this complex sequential process to new wafer…