Related papers: Technologies for 3D Heterogeneous Integration
To improve the dynamic response performance of wave code communication in intelligent layered water injection of oilfield, this paper proposes an output optimal fusion control method based on MPC-PID. Firstly, depending on the well…
Camera and 3D LiDAR sensors have become indispensable devices in modern autonomous driving vehicles, where the camera provides the fine-grained texture, color information in 2D space and LiDAR captures more precise and farther-away distance…
Lidars and cameras are critical sensors that provide complementary information for 3D detection in autonomous driving. While prevalent multi-modal methods simply decorate raw lidar point clouds with camera features and feed them directly to…
Silicon photonics, compatible with large-scale silicon manufacturing, is a disruptive photonic platform that has indicated significant implications in industry and research areas (e.g., quantum, neuromorphic computing, LiDAR). Cutting-edge…
Integrated sensing and communication (ISAC) is a promising solution to accelerate edge inference via the dual use of wireless signals. However, this paradigm needs to minimize the inference error and latency under ISAC co-functionality…
The demand for integrated photonic chips combining the generation and manipulation of quantum states of light is steadily increasing, driven by the need for compact and scalable platforms for quantum information technologies. While photonic…
Three-dimensional (3D)-stacking technology, which enables the integration of DRAM and logic dies, offers high bandwidth and low energy consumption. This technology also empowers new memory designs for executing tasks not traditionally…
Enhancing performance while reducing costs is the fundamental design philosophy of integrated circuits (ICs). With advancements in packaging technology, interposer-based chiplet architecture has emerged as a promising solution. Chiplet…
This paper proposes a novel UAV-to-Vehicle (U2V) channel model for sixth-generation (6G) intelligent sensing-communication integration, based on three-dimensional (3D) scatterer prediction. To explore the mapping relationship between…
The integration of III-V on silicon is still a hot topic as it will open up a way to co-integrate Si CMOS logic with photonic vices. To reach this aim, several hurdles should be solved, and more particularly the generation of antiphase…
This paper presents a compact and accurate representation of 3D scenes that are observed by a LiDAR sensor and a monocular camera. The proposed method is based on the well-established Stixel model originally developed for stereo vision…
2.5D integration is an important technique to tackle the growing cost of manufacturing chips in advanced technology nodes. This poses the challenge of providing high-performance inter-chiplet interconnects (ICIs). As the number of chiplets…
Overheating has emerged as a primary challenge constraining the reliability and performance of next-generation high-performance electronics, such as chiplets and (ultra)wide bandgap electronics. Advanced heterogeneous integration not only…
Sensor fusion has become a popular topic in robotics. However, conventional fusion methods encounter many difficulties, such as data representation differences, sensor variations, and extrinsic calibration. For example, the calibration…
Despite over a decade of intense research efforts, the full potential of two-dimensional transition metal dichalcogenides continues to be limited by major challenges. The lack of compatible and scalable dielectric materials and integration…
The miniaturization and integration of electronic circuitry has not only made the enormous increase in performance of semiconductor devices possible but also spawned a myriad of new products and applications ranging from a cellular phone to…
Infrared-visible image fusion (IVIF) has attracted much attention owing to the highly-complementary properties of the two image modalities. Due to the lack of ground-truth fused images, the fusion output of current deep-learning based…
Robust local feature representations are essential for spatial intelligence tasks such as robot navigation and augmented reality. Establishing reliable correspondences requires descriptors that provide both high discriminative power and…
Van der Waals integration enables the creation of electronic and optoelectronic devices with unprecedented performance and novel functionalities beyond the existing material limitations. However, it is typically realized using a physical…
The edge computing paradigm has emerged to handle cloud computing issues such as scalability, security and low response time among others. This new computing trend heavily relies on ubiquitous embedded systems on the edge. Performance and…