Related papers: Technologies for 3D Heterogeneous Integration
Microfabrication using nano- to micron-sized building blocks holds great potential for applications in next-generation electronics, optoelectronics, and advanced materials. However, traditional methods like chemical vapor deposition and…
This work presents a combined analytical and simulation-based study of a 3D-integrated quantum chip architecture. We model a flip-chip-inspired structure by stacking two superconducting qubits fabricated on separate high-resistivity silicon…
3D object detection using LiDAR-based point cloud data and deep neural networks is essential in autonomous driving technology. However, deploying state-of-the-art models on edge devices present challenges due to high computational demands…
Durable interfacing of hard and soft materials is a major design challenge caused by the ensuing stress concentrations. In nature, soft-hard interfaces exhibit remarkable mechanical performance, with failures rarely happening at the…
Fusing LiDAR and camera information is essential for achieving accurate and reliable 3D object detection in autonomous driving systems. This is challenging due to the difficulty of combining multi-granularity geometric and semantic features…
Underwater pipelines are highly susceptible to corrosion, which not only shorten their service life but also pose significant safety risks. Compared with manual inspection, the intelligent real-time imaging system for underwater pipeline…
CMOS Image Sensors are experiencing significant growth due to their capabilities to be integrated in smartphones with refined image quality. One of the major contributions to the growth of image sensors is the innovation brought about in…
Color plays an important role in human visual perception, reflecting the spectrum of objects. However, the existing infrared and visible image fusion methods rarely explore how to handle multi-spectral/channel data directly and achieve high…
Broadband mid-infrared (mid-IR) spectroscopy applications could greatly benefit from today's well-developed, highly scalable silicon photonics technology; however, this platform lacks broadband transparency due to its reliance on absorptive…
Microfluidic mixing is a fundamental functionality in most lab on a chip (LOC) systems,whereas realization of efficient mixing is challenging in microfluidic channels due to the small Reynolds numbers. Here, we design and fabricate a…
Light-field microscopy (LFM) enables single-shot capture of multi-angular information from biological samples, supporting real-time volumetric imaging. However, traditional physics-based algorithms often suffer from limited spatial…
Silicon photonic devices fundamental to high-density wavelength-division multiplexed (DWDM) optical links and photonic switching networks, such as resonant modulators and Mach-Zehnder interferometers (MZIs), are highly sensitive to…
As experimental quantum information processing (QIP) rapidly advances, an emerging challenge is to design a scalable architecture that combines various quantum elements into a complex device without compromising their performance. In…
Efficient coupling of III-V light sources to silicon photonic circuits is one of the key challenges of integrated optics. Important requirements are low coupling losses, as well as small footprint and high yield of the overall assembly,…
3D promises a new dimension in composing systems by aggregating chips. Literally. While the most common uses are still tightly connected with its early forms as a packaging technology, new application domains have been emerging. As the…
Three-dimensional (3D) integration continues to advance Moore's Law by facilitating dense interconnects and enabling multi-tier system architectures. Among the various integration approaches, Cu-Cu hybrid bonding has emerged as a leading…
Quantum photonic technologies, such as quantum key distribution, are already benefiting greatly from the rise of integrated photonics. However, the flexibility in design of these systems is often restricted by the properties of the…
Micro-transfer printing is an assembly technology that enables large-scale integration of diverse materials and components from micro- to nano-scale. However, traditional micro-transfer printing technologies lack dynamic selectivity,…
Achieving high performance, energy efficiency, and cost-effectiveness while maintaining architectural flexibility is a critical challenge in the development and deployment of edge AI devices. Monolithic SoC designs struggle with this…
Developing a packaging scheme that meets all of the requirements for operation of solid-state qubits in a cryogenic environment can be a formidable challenge. In this article, we discuss work being done in our group as well as in the…