Related papers: Technologies for 3D Heterogeneous Integration
Intelligent metasurfaces may be harnessed for realizing efficient holographic multiple-input and multiple-output (MIMO) systems, at a low hardware-cost and high energy-efficiency. As part of this family, we propose a hybrid beamforming…
Integrated quantum photonics holds significant promise for scalable photonic quantum information processing, quantum repeaters, and quantum networks, but its development is hindered by the mismatch between materials hosting high-quality…
Photonic integrated circuits utilize various waveguide materials, each excelling in specific metrics like efficient light emission, low propagation loss, high electro-optic efficiency, and potential for mass production. Inherent…
Modern integrated circuits are essentially two-dimensional (2D). Partial three-dimensional (3D) integration and 3D-transistor-level integrated circuits have long been anticipated as routes to improve the performance, cost and size of…
The rising use of deep learning and other big-data algorithms has led to an increasing demand for hardware platforms that are computationally powerful, yet energy-efficient. Due to the amount of data parallelism in these algorithms,…
Interfacial charge transfer (ICT) provides a powerful route to engineer electronic phases in correlated oxide heterostructures, yet predictive design principles remain elusive. Here, we systematically investigate superlattices composed of…
Monolithic 3D (M3D) technology enables high density integration, performance, and energy-efficiency by sequentially stacking tiers on top of each other. M3D-based network-on-chip (NoC) architectures can exploit these benefits by adopting…
The rapid development of quantum information processors has accelerated the demand for technologies that enable quantum networking. One promising approach uses mechanical resonators as an intermediary between microwave and optical fields.…
We present a general transfer method for the heterogeneous integration of different photonic and electronic materials systems and devices onto a single substrate. Called BLAST, for Bond, Lift, Align, and Slide Transfer, the process works at…
Heterogeneous 3D System-on-Chips (3D SoCs) are the most promising design paradigm to combine sensing and computing within a single chip. A special characteristic of communication networks in heterogeneous 3D SoCs is the varying latency and…
Photonic integrated circuits utilize planar waveguides to process light on a chip, encompassing functions like generation, routing, modulation, and detection. Similar to the advancements in the electronics industry, photonics research is…
Mid-infrared absorption spectroscopy is a well-established technique for non-destructive quantitative molecular analysis. Waveguide-integrated sensors provide a particularly compact solution operating with reduced sample volumes while…
We design and demonstrate a monolithically integrated silicon photonic multichannel optical hybrid for versatile broadband coherent reception, addressing the critical limitations of current wavelength multiplexed systems in scalability and…
By combining Three Dimensional Integrated Circuits with the Network-on-Chip infrastructure to obtain 3D Networks-on-Chip (3D-NoCs), the new on-chip communication paradigm brings several advantages on lower power, smaller footprint and lower…
Integrated photonic platforms have proliferated in recent years, each demonstrating its own unique strengths and shortcomings. However, given the processing incompatibilities of different platforms, a formidable challenge in the field of…
Three-dimensional (3D) photonic integration offers a pathway to overcome the fundamental scaling limitations of planar platforms by enabling enhanced routing flexibility for compact, low-loss, and highly interconnected photonic circuits. In…
Infrared and visible image fusion (IVIF) is increasingly applied in critical fields such as video surveillance and autonomous driving systems. Significant progress has been made in deep learning-based fusion methods. However, these models…
Hybrid photonic integration exploits complementary strengths of different material platforms, thereby offering superior performance and design flexibility in comparison to monolithic approaches. This applies in particular to multi-chip…
Multimodal 3D object detectors leverage the strengths of both geometry-aware LiDAR point clouds and semantically rich RGB images to enhance detection performance. However, the inherent heterogeneity between these modalities, including…
Growing interest in semiconductor workforce development has generated demand for platforms capable of supporting large numbers of independent hardware designs for research and training without imposing high per-project overhead. Traditional…