Related papers: Technologies for 3D Heterogeneous Integration
Infrared-visible image fusion aims to integrate infrared and visible information into a single fused image. Existing 2D fusion methods focus on fusing images from fixed camera viewpoints, neglecting a comprehensive understanding of complex…
The future wireless communications are expected to provide new use scenarios with emerging techniques. This paper focuses on vehicle to everything (V2X) network, where vehicles should cooperatively implement information obtaining, data…
3D object reconstruction from single-view image is a fundamental task in computer vision with wide-ranging applications. Recent advancements in Large Reconstruction Models (LRMs) have shown great promise in leveraging multi-view images…
We further develop a recently introduced phase-field model of rapid alloy solidification [Ji et al., PRL 2023]. This model utilizes enhanced solute diffusivity within the spatially diffuse interface region to quantitatively capture solute…
Integrated sensing and communication (ISAC) is one of the key usage scenarios for future sixth-generation (6G) mobile communication networks, where communication and sensing (C&S) services are simultaneously provided through shared wireless…
Next generation communication and sensing require enabling technologies for miniaturized and efficient heterogeneous systems while integrating technologies ranging from silicon to compound semiconductors and from photonic chips to…
Interface by definition is two-dimensional (2-D) as it separates 2 phases with an abrupt change in structure and chemistry across the interface. The interface between a metal and its nitride is expected to be atomically sharp, as chemical…
Traditional photonic integrated circuit (PIC) inherits the mature CMOS fabrication process from the electronic integrated circuit (IC) industry. However, this process also limits the PIC structure to a single-waveguide-layer configuration.…
Lithography, transferring chip design masks to the silicon wafer, is the most important phase in modern semiconductor manufacturing flow. Due to the limitations of lithography systems, Extensive design optimizations are required to tackle…
On-chip optical interconnect has been widely accepted as a promising technology to realize future large-scale multiprocessors. Mode-division multiplexing (MDM) provides a new degree of freedom for optical interconnects to dramatically…
Integrated photonics offers great potential for quantum communication devices in terms of complexity, robustness and scalability. Silicon photonics in particular is a leading platform for quantum photonic technologies, with further benefits…
The recent advances of hardware technology have made the intelligent analysis equipped at the front-end with deep learning more prevailing and practical. To better enable the intelligent sensing at the front-end, instead of compressing and…
With the soaring demand for high-performing integrated circuits, 3D integrated circuits (ICs) have emerged as a promising alternative to traditional planar structures. Unlike existing 3D ICs that stack 2D layers, a full 3D IC features cubic…
Due to the inherent in-direct bandgap nature of Silicon, heterogeneous integration of semiconductor lasers on Silicon on Insulator (SOI) is crucial for next-generation on-chip optical interconnects. Compact, high-efficient and high-tolerant…
With the growing demand for live video streaming, there is an increasing need for low-latency and high-quality transmission, especially with the advent of 5G networks. While 5G offers hardware-level improvements, effective software…
Micromechanical constitutive parameters are important for many engineering materials, typically in microelectronic applications and material design. Their accurate identification poses a three-fold experimental challenge: (i) deformation of…
Image tiling -- the seamless connection of disparate images to create a coherent visual field -- is crucial for applications such as texture creation, video game asset development, and digital art. Traditionally, tiles have been constructed…
The everlasting demand for higher computing power for deep neural networks (DNNs) drives the development of parallel computing architectures. 3D integration, in which chips are integrated and connected vertically, can further increase…
Color center platforms have been at the forefront of quantum nanophotonics for applications in quantum networking, computing, and sensing. However, large-scale deployment of this technology has been stifled by a lack of ability to integrate…
As the demand for high-speed and low-power electronics continues to grow, the quasi-delay-insensitive (QDI) asynchronous domain of digital design has emerged as a promising alternative to traditional clock-based designs. However, the…