Related papers: Technologies for 3D Heterogeneous Integration
In this paper, we propose a new deep architecture for fusing camera and LiDAR sensors for 3D object detection. Because the camera and LiDAR sensor signals have different characteristics and distributions, fusing these two modalities is…
Silicon Carbide (SiC) is an outstanding material, not only for electronic applications, but also for projected functionalities in the realm of photonic quantum technologies, nano-mechanical resonators and photonics on-a-chip. For shaping 3D…
In a multiprocessor system on chip (MPSoC) IC the processor is one of the highest heat dissipating devices. The temperature generated in an IC may vary with floor plan of the chip. This paper proposes an integration and thermal analysis…
Liquid structure at solid-liquid interfaces is critical for many natural and engineered processes ranging from biological signal transduction to electrochemical energy conversion. Advanced experimental and computational methods have…
Layer-by-layer assembly of van der Waals (vdW) heterostructures underpins new discoveries in solid state physics, material science and chemistry. Despite the successes, all current 2D material (2DM) transfer techniques rely on the use of…
Color centers in wide band gap semiconductors are prominent candidates for solid-state quantum technologies due to their attractive properties including optical interfacing, long coherence times, spin-photon and spin-spin entanglement, as…
As designs for superconducting qubits become more complex, 3D integration of two or more vertically bonded chips will become necessary to enable increased density and connectivity. Precise control of the spacing between these chips is…
Modern computing workloads demand energy-efficient, high-bandwidth interconnects, motivating photonic interposers as an alternative to electrical links. Here we demonstrate a compact 3D silicon nitride (SiN) photonic interposer prototype…
Hybrid systems have steadily grown in popularity over the last few decades because they ease the task of modeling complicated nonlinear systems. Legged locomotion, robotic manipulation, and additive manufacturing are representative examples…
3D visual grounding allows an embodied agent to understand visual information in real-world 3D environments based on human instructions, which is crucial for embodied intelligence. Existing 3D visual grounding methods typically rely on…
Dense 3D convolutions provide high accuracy for perception but are too computationally expensive for real-time robotic systems. Existing tri-plane methods rely on 2D image features with interpolation, point-wise queries, and implicit MLPs,…
This work outlines a new multi-physics-compatible immersed rigid body method for Eulerian finite-volume simulations. To achieve this, rigid bodies are represented as a diffuse scalar field and an interface seeding method is employed to…
Silicon photonic integration has gained great success in many application fields owing to the excellent optical device properties and complementary metal-oxide semiconductor (CMOS) compatibility. Realizing monolithic integration of III-V…
Owing to their intrinsic (geometry dependent) radiation hardness, 3D pixel sensors are promising candidates for the innermost tracking layers of the forthcoming experiment upgrades at the Phase 2 High-Luminosity LHC (HL-LHC). To this…
The semiconductor industry is reaching a fascinating confluence in several evolutionary trends that will likely lead to a number of revolutionary changes in the design, implementation, scaling, and the use of computer systems. However,…
3D object detection is fundamental for safe and robust intelligent transportation systems. Current multi-modal 3D object detectors often rely on complex architectures and training strategies to achieve higher detection accuracy. However,…
In this technical study, we introduce VFusedSeg3D, an innovative multi-modal fusion system created by the VisionRD team that combines camera and LiDAR data to significantly enhance the accuracy of 3D perception. VFusedSeg3D uses the rich…
Immersive computing (IC) technologies such as virtual reality and augmented reality are gaining tremendous popularity. In this poster, we present CoIC, a Cooperative framework for mobile Immersive Computing. The design of CoIC is based on a…
Accurate 3D imaging is essential for machines to map and interact with the physical world. While numerous 3D imaging technologies exist, each addressing niche applications with varying degrees of success, none have achieved the breadth of…
In this article, we present a real-time three dimensional (3D) hybrid beamforming for fifth generation (5G) wireless networks. One of the key concepts in 5G cellular systems is the small cell network, which settles the high mobile traffic…