Related papers: Technologies for 3D Heterogeneous Integration
Functional aspects as well as the influence of integration technology on the system behavior have to be considered in the 3D integration design process of micro systems. Therefore, information from different physical domains has to be…
At sub-20nm technologies CMOS scaling faces severe challenges primarily due to fundamental device scaling limitations, interconnection overhead and complex manufacturing. Migration to 3D has been long sought as a possible pathway to…
We present MVD-Fusion: a method for single-view 3D inference via generative modeling of multi-view-consistent RGB-D images. While recent methods pursuing 3D inference advocate learning novel-view generative models, these generations are not…
Conventional 2D CMOS technology is reaching fundamental scaling limits, and interconnect bottleneck is dominating integrated circuit (IC) power and performance. While 3D IC technologies using Through Silicon Via or Monolithic Inter-layer…
High-performance Radar-Camera 3D object detection can be achieved by leveraging knowledge distillation without using LiDAR at inference time. However, existing distillation methods typically transfer modality-specific features directly to…
This paper reports on 3D-printed dielectric image lines for low-loss subTHz applications between 140 and 220 GHz. In contrast to conventional dielectric waveguides, a conductive copper substrate is used to achieve robust routing and…
Visible and infrared image fusion (VIF) aims to combine information from visible and infrared images into a single fused image. Previous VIF methods usually employ a color space transformation to keep the hue and saturation from the…
Multispectral object detection aims to leverage complementary information from visible (RGB) and infrared (IR) modalities to enable robust performance under diverse environmental conditions. Our key insight, derived from wavelet analysis…
In three dimensional integrated circuits (3D-ICs), through silicon via (TSV) is a critical technique in providing vertical connections. However, the yield and reliability is one of the key obstacles to adopt the TSV based 3D-ICs technology…
In this article, we present a technology development of a superconducting qubit device 3D-integrated by flip-chip-bonding and processed following CMOS fabrication standards and contamination rules on 200 mm wafers. We present the utilized…
Metal inter-layer via (MIV) in Monolithic three-dimensional integrated circuits (M3D-IC) is used to connect inter-layer devices and provide power and clock signals across multiple layers. The size of MIV is comparable to logic gates because…
Computing-in-memory (CIM) is renowned in deep learning due to its high energy efficiency resulting from highly parallel computing with minimal data movement. However, current SRAM-based CIM designs suffer from long latency for loading…
As superconducting qubit circuits become more complex, addressing a large array of qubits becomes a challenging engineering problem. Dense arrays of qubits benefit from, and may require, access via the third dimension to alleviate…
Diffusion-based image generators can now produce high-quality and diverse samples, but their success has yet to fully translate to 3D generation: existing diffusion methods can either generate low-resolution but 3D consistent outputs, or…
Hyperdimensional computing (HDC) is an emerging computing paradigm that represents, manipulates, and communicates data using very long random vectors (aka hypervectors). Among different hardware platforms capable of executing HDC…
Coherent optics has profoundly impacted diverse applications ranging from communications, LiDAR to quantum computations. However, building coherent systems in integrated photonics previously came at great expense in hardware integration and…
4H-silicon carbide is a promising platform for solid-state quantum technology due to its commercial availability as a wide bandgap semiconductor and ability to host numerous spin-active color centers. Integrating color centers into…
Today, continued miniaturization in electronic integrated circuits (ICs) appears to have reached its fundamental limit. At the same time, energy consumption due by communication becomes the dominant limitation in high performance electronic…
Multiple-input multiple-output (MIMO) orthogonal frequency-division multiplexing (OFDM) systems rely on digital or hybrid digital and analog designs for beamforming against frequency-selective fading, which suffer from high hardware…
Silicon is an excellent material for microelectronics and integrated photonics with untapped potential for mid-IR optics. Despite broad recognition of the importance of the third dimension, current lithography methods do not allow…