相关论文: Cooling Channel Design Optimization for High Power…
Methane is considered being a good choice as a propellant for future reusable launch systems. However, the heat transfer prediction for supercritical methane flowing in cooling channels of a regeneratively cooled combustion chamber is…
Future multiprocessor chips will integrate many different units, each tailored to a specific computation. When designing such a system, the chip architect must decide how to distribute limited system resources such as area, power, and…
Managing energy and thermal profiles is critical for many-core HPC processors with hundreds of application-class processing elements (PEs). Advanced model predictive control (MPC) delivers state-of-the-art performance but requires solving…
Periodic fin structures are often employed to enhance heat transfer in compact cooling solutions and heat exchangers. Adjoint-based optimization methods are able to further increase the heat transfer by optimizing the fin geometry. However,…
This paper presents an efficient methodology for the robust optimisation of Continuous Flow Polymerase Chain Reaction (CFPCR) devices. It enables the effects of uncertainties in device geometry, due to manufacturing tolerances, on the…
Increasing AI computing demands and slowing transistor scaling have led to the advent of Multi-Chip-Module (MCMs) based accelerators. MCMs enable cost-effective scalability, higher yield, and modular reuse by partitioning large chips into…
The need to develop systems that exploit multi and many-core architectures to reduce wasteful heat generation is of utmost importance in compute-intensive applications. We propose an energy-conscious approach to multicore scheduling known…
Microfluidic cooling has been recognized as one of the most promising solutions to achieve efficient thermal management for three-dimensional integrated circuits (3DICs). It enables more opportunities to architect 3DICs with different die…
This paper presents an energy-optimal hybrid control framework for thermal management of heat-pump battery electric vehicles (BEVs). The controller coordinates the compressor, coolant pumps, and cabin blower across the coupled refrigerant,…
Power modules with excellent inductance and temperature metrics are significant to meet the rising sophistication of energy demand in new technologies. In this paper, we use a surrogate-based approach to render optimal layouts of power…
Emerging technologies like hypersonic aircraft, space exploration vehicles, and batteries avail fluid circulation in embedded microvasculatures for efficient thermal regulation. Modeling is vital during these engineered systems' design and…
The energy cost of computation has emerged as a central challenge at the intersection of physics and computer science. Recent advances in statistical physics -- particularly in stochastic thermodynamics -- enable precise characterizations…
We present an overview of the Graphics Processing Unit (GPU) based spatial processing system created for the Canadian Hydrogen Intensity Mapping Experiment (CHIME). The design employs AMD S9300x2 GPUs and readily-available commercial…
Topology optimization is used to systematically design contact-aided thermo-mechanical regulators, i.e. components whose effective thermal conductivity is tunable by mechanical deformation and contact. The thermo-mechanical interactions are…
Packages capable of supporting large arrays of high-coherence superconducting qubits are vital for the realisation of fault-tolerant quantum computers and the necessary high-throughput metrology required to optimise fabrication and…
Multi-chiplet architectures enabled by glass interposer offer superior electrical performance, enable higher bus widths due to reduced crosstalk, and have lower capacitance in the redistribution layer than current silicon interposer-based…
We propose an optimization approach for determining both hardware and software parameters for the efficient implementation of a (family of) applications called dense stencil computations on programmable GPGPUs. We first introduce a simple,…
Large-scale cryogenic Input-Output (IO) infrastructure is a requirement for realising fault-tolerant quantum computing in solid-state modalities. Such IO scaling presents significant challenges in thermal modelling, hardware design and…
Scaling superconducting quantum computers to the fault-tolerant regime calls for a commensurate scaling of the classical control and readout stack. Today's systems largely rely on room-temperature, rack-based instrumentation connected to…
3D integrated circuit (3D-IC) technology gained acceptance due to the ability to achieve extremely high level of integration, where hundreds of ICs are stacked vertically. Such level of integration can result in local power dissipation of…