相关论文: Exploring the Efficiency of 3D-Stacked AI Chip Arc…

Advances in hybrid bonding and packaging have driven growing interest in 3D DRAM-stacked accelerators with higher memory bandwidth and capacity. As LLMs scale to hundreds of billions or trillions of parameters, distributed inference across…

Dataflow-oriented spatial architectures are the emerging paradigm for higher computation performance and efficiency. AMD Versal AI Engine is a commercial spatial architecture consisting of tiles of VLIW processors supporting SIMD operations…

The 3D point cloud perception has emerged as a fundamental role for a wide range of applications. In particular, with the rapid development of neural networks, the voxel-based networks attract great attention due to their excellent…

Large language models (LLMs) exhibit memory-intensive behavior during decoding, making it a key bottleneck in LLM inference. To accelerate decoding execution, hybrid-bonding-based 3D-DRAM has been adopted in LLM accelerators. While this…

3D integration offers key advantages in improving system performance and efficiency for the End-of-Scaling era. It enables the incorporation of heterogeneous system components and disparate technologies, eliminates off-chip communication…

Efficient AI inference on AMD's Versal AI Engine (AIE) is challenging due to tightly coupled VLIW execution, explicit datapaths, and local memory management. Prior work focused on first-generation AIE kernel optimizations, without tackling…

Large language model (LLM) decoding is a major inference bottleneck because its low arithmetic intensity makes performance highly sensitive to memory bandwidth. 3D-stacked near-memory processing (NMP) provides substantially higher local…

The rapid growth of large-language models (LLMs) is driving a new wave of specialized hardware for inference. This paper presents the first workload-centric, cross-architectural performance study of commercial AI accelerators, spanning…

Compound AI applications, composed from interactions between Large Language Models (LLMs), Machine Learning (ML) models, external tools and data sources are quickly becoming an integral workload in datacenters. Their diverse sub-components…

The rapid scaling of large language models (LLMs) has unveiled critical limitations in current hardware architectures, including constraints in memory capacity, computational efficiency, and interconnection bandwidth. DeepSeek-V3, trained…

3D integration, i.e., stacking of integrated circuit layers using parallel or sequential processing is gaining rapid industry adoption with the slowdown of Moore's law scaling. 3D stacking promises potential gains in performance, power and…

To meet the increasing demand of deep learning (DL) models, AI chips are employing both off-chip memory (e.g., HBM) and high-bandwidth low-latency interconnect for direct inter-core data exchange. However, it is not easy to explore the…

Recent advances in bioimaging have provided scientists a superior high spatial-temporal resolution to observe dynamics of living cells as 3D volumetric videos. Unfortunately, the 3D biomedical video analysis is lagging, impeded by resource…

Over the last three decades, innovations in the memory subsystem were primarily targeted at overcoming the data movement bottleneck. In this paper, we focus on a specific market trend in memory technology: 3D-stacked memory and caches. We…

Real-time 3D mapping is a critical component in many important applications today including robotics, AR/VR, and 3D visualization. 3D mapping involves continuously fusing depth maps obtained from depth sensors in phones, robots, and…

Large Vision-Language Models (LVLMs) enable sophisticated reasoning over images and videos, yet their inference is hindered by a systemic efficiency barrier known as visual token dominance. This overhead is driven by a multi-regime…

This paper focuses on the simulation of multi-die System-on-Chip (SoC) architectures using VisualSim, emphasizing chiplet-based system modeling and performance analysis. Chiplet technology presents a promising alternative to traditional…

Large Language Model (LLM) inference requires substantial computational resources, yet CPU-based inference remains essential for democratizing AI due to the widespread availability of CPUs compared to specialized accelerators. However,…

Conventional large language models (LLMs) are equipped with dozens of GB to TB of model parameters, making inference highly energy-intensive and costly as all the weights need to be loaded to onboard processing elements during computation.…

Poor DRAM technology scaling over the course of many years has caused DRAM-based main memory to increasingly become a larger system bottleneck. A major reason for the bottleneck is that data stored within DRAM must be moved across a…