相关论文: In-pixel integration of signal processing and AI/M…

Detectors at future high energy colliders will face enormous technical challenges. Disentangling the unprecedented numbers of particles expected in each event will require highly granular silicon pixel detectors with billions of readout…

We present a smart pixel prototype readout integrated circuit (ROIC) designed in CMOS 28 nm bulk process, with in-pixel implementation of an artificial intelligence (AI) / machine learning (ML) based data filtering algorithm designed as…

Modern scientific instruments operate under increasingly extreme constraints on bandwidth, latency, and power. Inference at the sensor edge determines experimental data collection efficiency by deciding which information to save for further…

CMOS Pixel Sensors tend to become relevant for a growing spectrum of charged particle detection instruments. This comes mainly from their high granularity and low material budget. However, several potential applications require a higher…

The two innermost layers of the ALICE inner tracking system are instrumented with silicon pixel detectors. Single chip assembly prototypes of the ALICE pixels have been tested in high energy particle beams at the CERN SPS. Detection…

Highly granular pixel detectors allow for increasingly precise measurements of charged particle tracks. Next-generation detectors require that pixel sizes will be further reduced, leading to unprecedented data rates exceeding those foreseen…

In the last years, high-resolution time tagging has emerged as the tool to tackle the problem of high-track density in the detectors of the next generation of experiments at particle colliders. Time resolutions below 50ps and event average…

Edge devices equipped with computer vision must deal with vast amounts of sensory data with limited computing resources. Hence, researchers have been exploring different energy-efficient solutions such as near-sensor processing, in-sensor…

We present a scalable in-pixel processing architecture that can reduce the data throughput by 10X and consume less than 30 mW per megapixel at the imager frontend. Unlike the state-of-the-art (SOA) analog process-in-pixel (PIP) that…

The Inner Tracking System (ITS) Upgrade for the ALICE experiment at LHC is the first large-area ($\sim$10~m$^2$) silicon vertex detector based on the CMOS Monolithic Active Pixel Sensor (MAPS) technology, which combines sensitive volume and…

The explosion of data volume in communications, AI training, and cloud computing requires efficient data handling, which is typically stored as digital electrical information and transmitted as wireless radio frequency (RF) signals or light…

The ATLAS collaboration will replace its tracking detector with new all silicon pixel and strip systems. This will allow to cope with the higher radiation and occupancy levels expected after the 5-fold increase in the luminosity of the LHC…

Pixel sensors based on commercial high-voltage CMOS processes are an exciting technology that is considered as an option for the outer layer of the ATLAS inner tracker upgrade at the High Luminosity LHC. Here, charged particles are detected…

In order to take full advantage of the U.S. Department of Energy's billion-dollar investments into the next-generation research infrastructure (e.g., exascale, light sources, colliders), advances are required not only in detector technology…

We present the first characterization results of Timespot1, an ASIC designed in CMOS 28 nm technology, featuring a $32 \times 32$ pixel matrix with a pitch of $55 ~ \mu m$. Timespot1 is the first small-size prototype, conceived to readout…

The existing ATLAS Tracker will be at its functional limit for particle fluences of 10^15 neq/cm^2 (LHC). Thus for the upgrades at smaller radii like in the case of the planned Insertable B-Layer (IBL) and for increased LHC luminosities…

The Inner Tracking System (ITS) of the ALICE experiment at CERN will undergo an upgrade during the LHC long shutdown 3, in which the three innermost tracking layers will be replaced. This upgrade, named the Inner Tracking System 3 (ITS3),…

The performance of novel n-in-p planar pixel detectors, designed for future upgrades of the ATLAS Pixel system is presented. The n-in-p silicon sensors technology is a promising candidate for the pixel upgrade thanks to its radiation…

The experiments at LHC are implementing novel and challenging detector upgrades for the High Luminosity LHC, among which the tracking systems. This paper reports on performance studies, illustrated by an electron trigger, using a simplified…

We present a readout chip prototype for future pixel detectors with timing capabilities. The prototype is intended for characterizing 4D pixel arrays with a pixel size of $100\times100~\mu \text{m}^2$, where the sensors are Low Gain…