相关论文: ProForm: Solder-Free Circuit Assembly Using Thermo…
Spurred by the increasing needs in electrochemical energy storage devices, the electrode/electrolyte interface has received a lot of interest in recent years. Molecular dynamics simulations play a proeminent role in this field since they…
Freestanding thin films, a class of low-dimensional materials capable of maintaining structural integrity without substrates, have emerged as a forefront research focus. Their unique advantages-circumventing substrate clamping, liberating…
A superconducting diode is an electronic device that conducts supercurrent and exhibits zero resistance primarily for one direction of applied current. Such a dissipationless diode is a desirable unit for constructing electronic circuits…
The eXtended Finite Element Method (XFEM) is an approach for solving problems with non-smooth solutions. In the XFEM, the approximate solution is locally enriched to capture discontinuities without requiring a mesh which conforms to the…
Soft adhesive pads are needed for many robotics applications, and one approach is based on electroadhesion. Here we present a general analytic model and numerical results for electroadhesion for soft solids with arbitrary time-dependent…
Design of novel artificial materials based on ferroelectric perovskites relies on the basic principles of electrostatic coupling and in-plane lattice matching. These rules state that the out-of-plane component of the electric displacement…
Understanding how quantum materials return to equilibrium after being driven into excited states is a fundamental problem in condensed matter physics. A prototypical material, 1T-TaS$_2$, exhibits complex electronic textures made up of…
We propose a thermodynamically consistent general-purpose model describing diffusion of a solute or a fluid in a solid undergoing possible phase transformations and damage, beside possible visco-inelastic processes. Also heat…
During the last few years, serial electron crystallography (Serial Electron Diffraction, SerialED) has been gaining attention for the structure determination of crystalline compounds that are sensitive to the irradiation of the electron…
Efficient electron-refrigeration based on a normal-metal/spin-filter/superconductor junction is proposed and demonstrated theoretically. The spin-filtering effect leads to values of the cooling power much higher than in conventional…
Conventional electrical circuits are generally rigid in their components and working styles which are not flexible and stretchable. From an alternative, liquid metal based soft electronics is offering important opportunities for innovating…
Existing flexible electronics are planar, nonbreathable, and easily damaged. In this work, authors introduce a new paradigm of free-form three-dimensional integrated circuits assembled on a single textile thread for ultimate flexibility.…
The vast majority of modern microelectronic devices rely on carriers within semiconductors due to their integrability. Therefore, the performance of these devices is limited due to natural semiconductor properties such as band gap and…
This work builds on the previous introduction [1] of a coupled experimental-computational system devised to fully characterize the thermal behavior of complex 3D submicron electronic devices. The new system replaces the laser-based surface…
This paper presents and studies an approach for constructing auxiliary space preconditioners for finite element problems using a constrained nonconforming reformulation, that is based on a proposed modified version of the mortar method. The…
Major challenges of micro thermal machines are the thermal insulation and mechanical tolerance in the case of sliding piston. Switching from piston to membrane in microengines can alleviate the latest and lead to planar architectures.…
Sim-to-real transfer remains a significant challenge in soft robotics due to the unpredictability introduced by common manufacturing processes such as 3D printing and molding. These processes often result in deviations from simulated…
Empirical evidence in heavy fermion, pnictide, and other systems suggests that unconventional superconductivity appears associated to some form of real-space electronic order. For the cuprates, despite several proposals, the emergence of…
3D part assembly aims to understand part relationships and predict their 6-DoF poses to construct realistic 3D shapes, addressing the growing demand for autonomous assembly, which is crucial for robots. Existing methods mainly estimate the…
Wearable electronic devices and gadgets raise the need for flexible, thin and lightweight batteries. In this article we present for the first time, a unique, single-step method for the preparation of a membrane-electrode assembly for…