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Thermal issue is of great importance during layout design of heat source components in systems engineering, especially for high functional-density products. Thermal analysis generally needs complex simulation, which leads to an unaffordable…

机器学习 · 计算机科学 2021-03-23 Xianqi Chen , Xiaoyu Zhao , Zhiqiang Gong , Jun Zhang , Weien Zhou , Xiaoqian Chen , Wen Yao

Recently, surrogate models based on deep learning have attracted much attention for engineering analysis and optimization. As the construction of data pairs in most engineering problems is time-consuming, data acquisition is becoming the…

机器学习 · 计算机科学 2021-09-28 Xiaoyu Zhao , Zhiqiang Gong , Yunyang Zhang , Wen Yao , Xiaoqian Chen

In context of laser powder bed fusion (L-PBF), it is known that the properties of the final fabricated product highly depend on the temperature distribution and its gradient over the manufacturing plate. In this paper, we propose a novel…

人工智能 · 计算机科学 2023-01-31 Ashkan Mansouri Yarahmadi , Michael Breuß , Carsten Hartmann

Reducing energy consumption and carbon emissions in data centers by enabling real-time temperature prediction is critical for sustainability and operational efficiency. Achieving this requires accurate modeling of the 3D temperature field…

With electric power systems becoming more compact and increasingly powerful, the relevance of thermal stress especially during overload operation is expected to increase ceaselessly. Whenever critical temperatures cannot be measured…

机器学习 · 计算机科学 2022-11-03 Wilhelm Kirchgässner , Oliver Wallscheid , Joachim Böcker

Thermal errors in machine tools significantly impact machining precision and productivity. Traditional thermal error correction/compensation methods rely on measured temperature-deformation fields or on transfer functions. Most existing…

机器学习 · 计算机科学 2025-10-07 C. Coelho , M. Hohmann , D. Fernández , L. Penter , S. Ihlenfeldt , O. Niggemann

Temperature field prediction is of great importance in the thermal design of systems engineering, and building the surrogate model is an effective way for the task. Generally, large amounts of labeled data are required to guarantee a good…

机器学习 · 计算机科学 2023-01-18 Yunyang Zhang , Zhiqiang Gong , Weien Zhou , Xiaoyu Zhao , Xiaohu Zheng , Wen Yao

Besides the lot of advantages offered by the 3D stacking of devices in an integrated circuit there is a chance of device damage due to rise in peak temperature value. Hence, in order to make use of all the potential benefits of the vertical…

新兴技术 · 计算机科学 2012-03-09 Ramya Menon C. , Vinod Pangracious

Modeling plays a critical role in additive manufacturing (AM), enabling a deeper understanding of underlying processes. Parametric solutions for such models are of great importance, enabling the optimization of production processes and…

计算工程、金融与科学 · 计算机科学 2025-02-05 Hesameddin Safari , Henning Wessels

Thermal management in the hyper-scale cloud data centers is a critical problem. Increased host temperature creates hotspots which significantly increases cooling cost and affects reliability. Accurate prediction of host temperature is…

分布式、并行与集群计算 · 计算机科学 2020-12-17 Shashikant Ilager , Kotagiri Ramamohanarao , Rajkumar Buyya

Thermal issue is a major concern in 3D integrated circuit (IC) design. Thermal optimization of 3D IC often requires massive expensive PDE simulations. Neural network-based thermal prediction models can perform real-time prediction for many…

机器学习 · 计算机科学 2023-02-28 Ziyue Liu , Yixing Li , Jing Hu , Xinling Yu , Shinyu Shiau , Xin Ai , Zhiyu Zeng , Zheng Zhang

The two-dimensional (2D) Hubbard model has long attracted interest for its rich phase diagram and its relevance to high-$T_c$ superconductivity. However, reliable finite-temperature studies remain challenging due to the exponential…

强关联电子 · 物理学 2025-10-30 Changkai Zhang , Jan von Delft

Three-dimensional (3D)-stacking technology, which enables the integration of DRAM and logic dies, offers high bandwidth and low energy consumption. This technology also empowers new memory designs for executing tasks not traditionally…

硬件体系结构 · 计算机科学 2018-12-05 Ramyad Hadidi , Bahar Asgari , Burhan Ahmad Mudassar , Saibal Mukhopadhyay , Sudhakar Yalamanchili , Hyesoon Kim

Hotspot detection using thermal imaging has recently become essential in several industrial applications, such as security applications, health applications, and equipment monitoring applications. Hotspot detection is of utmost importance…

计算机视觉与模式识别 · 计算机科学 2023-08-28 Shreyas Goyal , Jagath C. Rajapakse

Modern data-intensive applications demand high computation capabilities with strict power constraints. Unfortunately, such applications suffer from a significant waste of both execution cycles and energy in current computing systems due to…

High Bandwidth Memory (HBM), as a key development trend in future memory chip technology, significantly enhances computer performance. At the same time, the thermal challenges arising from its stacked architecture have drawn considerable…

应用物理 · 物理学 2025-10-10 Zhihao Zhou , Yu He , Shixian Liu , Lina Yang , Nuo Yang

Monitoring the magnet temperature in permanent magnet synchronous motors (PMSMs) for automotive applications is a challenging task for several decades now, as signal injection or sensor-based methods still prove unfeasible in a commercial…

机器学习 · 计算机科学 2021-01-27 Wilhelm Kirchgässner , Oliver Wallscheid , Joachim Böcker

In this work, deep neural networks made up of multiple hidden Long Short-Term Memory (LSTM) and Feedforward layers are trained to predict the thermal behavior of the joint motors of robot manipulators. A model-free and scalable approach is…

机器人学 · 计算机科学 2025-09-17 Trung Kien La , Eric Guiffo Kaigom

Virtually all electronic systems try to optimize a fundamental trade-off between higher performance and lower power consumption. The latter becomes critical in mobile computing systems, such as smartphones, which rely on passive cooling.…

系统与控制 · 电气工程与系统科学 2020-03-26 Ganapati Bhat , Suat Gumussoy , Umit Y. Ogras

We employ the numerical linked-cluster expansion to study finite-temperature properties of the uniform cubic lattice Hubbard model in the thermodynamic limit for a wide range of interaction strengths and densities. We carry out the…

强关联电子 · 物理学 2016-09-13 Ehsan Khatami
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