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The complexities of today's materials simulations demand computer codes which are both powerful and highly flexible. A researcher should be able to readily choose different geometries, different materials and different algorithms without…

In an aircraft electric power system (EPS), a supervisory control unit must actuate a set of switches to distribute power from generators to loads, while satisfying safety, reliability and real-time performance requirements. To reduce…

系统与控制 · 计算机科学 2013-11-26 Pierluigi Nuzzo , John Finn , Mohammad Mozumdar , Alberto Sangiovanni-Vincentelli

Medical electrophysiological sensors that can study the body and diagnose diseases depend on consistently low impedance electrode-skin interfaces. Clinical-standard wet electrodes use hydrogels and skin abrasion to improve the interface and…

Fiber-Reinforced Polymer Composite (FRPC) parts are mostly made as laminates, shells, or surfaces wound with 2D fiber patterns even after the emergence of additive manufacturing. Making FRPC parts with embedded continuous fibers in 3D is…

软凝聚态物质 · 物理学 2025-08-12 Vivek Khatua , B. Gurumoorthy , G. K. Ananthasuresh

As soft robot design matures, researchers have converged to sophisticated design paradigms to enable the development of more suitable platforms. Two such paradigms are soft-rigid hybrid robots, which utilize rigid structural materials in…

机器人学 · 计算机科学 2025-06-05 Zach J. Patterson , Emily R. Sologuren , Daniela Rus

During the COVID-19 pandemic, medical facilities began using 3D printed PPE sourced from their own print labs, makerspaces, universities, and individuals with 3D printers to fill the gaps in supply as traditional manufacturing was not…

医学物理 · 物理学 2021-04-14 Hannelore Hemminger , Xiaoyu , Zheng

Several different approaches are proposed for solving fully implicit discretizations of a simplified Boltzmann-Poisson system with a linear relaxation-type collision kernel. This system models the evolution of free electrons in…

计算物理 · 物理学 2020-07-15 M. Paul Laiu , Zheng Chen , Cory D. Hauck

It may be possible to reinvent how microelectronics are made using a two step process: (1) Synthesizing modular, nanometer-scale components -- transistors, sensors, and other devices -- and suspending them in a liquid "ink" for storage or…

计算机与社会 · 计算机科学 2023-03-21 Michael Filler , Benjamin Reinhardt

The transition toward software-defined vehicles requires standardization and modularization of hardware decoupled from software, along with centralized electrical/electronic architectures. While electrified drive units, such as integrated…

系统与控制 · 电气工程与系统科学 2026-04-21 Shiu Mochiyama , Rikuto Kawasome

Soft materials capable of large inelastic deformation play an essential role in high-performance nacre-inspired architectured materials with a combination of stiffness, strength and toughness. The rigid "building blocks" made from glass or…

软凝聚态物质 · 物理学 2021-02-16 Shibo Zou , Daniel Therriault , Frédérick P. Gosselin

Scaling up hardware systems has become an important tactic for improving performance as Moore's law fades. Unfortunately, simulations of large hardware systems are often a design bottleneck due to slow throughput and long build times. In…

分布式、并行与集群计算 · 计算机科学 2024-07-31 Steven Herbst , Noah Moroze , Edgar Iglesias , Andreas Olofsson

A simple circuit for the presentation of the signals from Multi-gap Resistive Plate Chambers (MRPCs) to standard existing digitization electronics is described. The circuit is based on "off-the-shelf" discrete components. An optimization of…

仪器与探测器 · 物理学 2008-11-26 W. J. Llope , T. Nussbaum , G. Eppley , J. Velkovska , T. Chujo , S. Huang , B. Love , H. Valle , L. Ruan , Z. Xu , B. Bonner

Sim-to-real transfer remains a significant challenge in soft robotics due to the unpredictability introduced by common manufacturing processes such as 3D printing and molding. These processes often result in deviations from simulated…

机器人学 · 计算机科学 2025-12-02 Pierluigi Mansueto , Mihai Dragusanu , Anjum Saeed , Monica Malvezzi , Matteo Lapucci , Gionata Salvietti

Printed circuit boards (PCBs) are widely used in most electrical and electronic equipments or products. Hazardous substances such as Pb, Hg, Cd, etc, can be present in high concentrations in PCBs and the degradation and release of these…

仪器与探测器 · 物理学 2014-09-17 M. L. Fu , D. Irzhak , R. Fakhrtdinov , M. Grigoriev , B. S. Quan , Z. C. Le , D. Roshchupkin

Embedded Systems combine one or more processor cores with dedicated logic running on an ASIC or FPGA to meet design goals at reasonable cost. It is achieved by profiling the application with variety of aspects like performance, memory…

性能 · 计算机科学 2013-12-12 Rajendra Patel , Arvind Rajwat

This paper introduces a computational composite material comprising layers for actuation, computation and energy storage. Key to its design is inexpensive materials assembled from traditionally available fabrication machines to support the…

人机交互 · 计算机科学 2022-12-21 Xinyi Yang , Martin Nisser , Stefanie Mueller

Printed and flexible electronics (PFE) have emerged as the ubiquitous solution for application domains at the extreme edge, where the demands for low manufacturing and operational cost cannot be met by silicon-based computing. Built on…

硬件体系结构 · 计算机科学 2025-05-02 Mehdi B. Tahoori , Emre Ozer , Georgios Zervakis , Konstantinos Balaskas , Priyanjana Pal

Recent advances in the preparation, control and measurement of atomic gases have led to new insights into the quantum world and unprecedented metrological sensitivities, e.g. in measuring gravitational forces and magnetic fields. The full…

量子物理 · 物理学 2017-04-07 R. Saint , W. Evans , Y. Zhou , T. M. Fromhold , E. Saleh , I. Maskery , C. Tuck , R. Wildman , F. Oručević , P. Krüger

In-memory computing technology is used extensively in artificial intelligence devices due to lower power consumption and fast calculation of matrix-based functions. The development of such a device and its integration in a system takes a…

3D integrated circuit (3D-IC) technology gained acceptance due to the ability to achieve extremely high level of integration, where hundreds of ICs are stacked vertically. Such level of integration can result in local power dissipation of…

应用物理 · 物理学 2019-11-04 Chandrasekhar Mandalapu , Ibrahim M Abdel-Motaleb , Sangki Hong , Robert Patti