相关论文: Design and Simulation of a Micro-coiled Digitally-…
Use of 2G HTS coated conductors in several power applications has become popular in recent years. Their large current density under high magnetic fields makes them suitable candidates for high power capacity applications such as stacks,…
Electrical control of magnetism in a two-dimensional (2D) semiconductor is of great interest for emerging nanoscale low-dissipation spintronic devices. Here, we propose a general approach of tuning magnetic coupling and anisotropy of a van…
This paper presents analytic study and design considerations of flat wire inductors with distributed gaps for high-power and compact DC-DC Converters. The focus is eddy current loss components within the conductors due to fringing and…
The Divertor Tokamak Test (DTT) facility will be equipped with in-vessel divertor coils able to locally modify the flux surfaces in the divertor region. When the first DTT divertor had not been selected, four in-vessel divertor coils were…
We present design, fabrication and characterization of a MEMS VCSEL which utilizes a silicon-on-insulator wafer for the microelectromechanical system and encapsulates the MEMS by direct InP wafer bonding, which improves the protection and…
The stress-management cos-theta (SMCT) coil is a new concept which has been proposed and is being developed at Fermilab in the framework of US Magnet Development Program (US-MDP) for high-field and/or large-aperture accelerator magnets…
The first pre-prototype of a single-coil superconducting miniundulator has been built and studied. Its basic specifications include 10 main periods and two end compensation periods, a period length of 7 mm, and a gap of 2 mm. The design is…
The paper proposes the design of a tri-mode coupled coil which enables three modes of operation for inducing electromagnetic field, where the focal adjustment of the E field can be optimized. Methods: The setup consists of two identical…
This paper presents the design, fabrication, and experimental validation of a reconfigurable intelligent surface (RIS) employing electrically actuated vanadium dioxide (VO2) switches for millimeter wave beam steering. The proposed RIS is…
The smart integrated systems of tomorrow would demand a combination of micromechanical components and traditional electronics. On-chip solutions will be the ultimate goal. One way of making such systems is to implement the mechanical parts…
In this work, we proposed a new 3D integration technology: the Flip 3D integration (F3D), consisting of the 3D transistor stacking, the 3D dual-sided interconnects, the 3D die-to-die stacking and the dual-sided Monolithic 3D (M3D). Based on…
Here a minimum power dissipation coil transducer has been designed to allow in-flight noise characterization of a low-frequency magnetic measurement system. The coil was produced using PCB technology to provide mechanical stability and easy…
Air-stable semiconducting inks suitable for complementary logic are key to create low-power printed integrated circuits (ICs). High-performance printable electronic inks with two-dimensional materials have the potential to enable the next…
Quantum sensors based on cold atoms are being developed which produce measurements of unprecedented accuracy. Due to shifts in atomic energy levels, quantum sensors often have stringent requirements on their internal magnetic field…
REBCO high-temperature superconductors are promising for fully superconducting high-field magnets, including ultra-high field magnets. Non-insulated (NI) and metal-insulated (MI) windings are a good solution for protection against…
In ultracold-atom and ion experiments, flexible control of the direction and amplitude of a uniform magnetic field is necessary. It is achieved almost exclusively by controlling the current flowing through coils surrounding the experimental…
Three-dimensional self-assembly of lithographically patterned ultrathin films opens a path to manufacture microelectronic architectures with functionalities and integration schemes not accessible by conventional two-dimensional…
Integrated micro-nanochannel networks in fluidic devices are desirable in a number of applications ranging from self-healing/cooling materials to bioengineering. The conventional micro-manufacturing techniques are capable of either…
This study presents the design, simulation, and experimental validation of a novel multimodal concentric surface coil for MR imaging, developed to achieve higher B1 field efficiency while maintaining low SAR for enhanced imaging…
We present a magnetic field confining coil with a sub-$10^{-3}$ field uniformity over a large fraction of the coil. The structure is entirely made out of printed circuit boards (PCBs). The PCB design allows to tailor the path of wires to…