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A framework for topology optimization of cooling channels is proposed, which paves the way towards automated design of additively-manufactured cooling channels, required in applications such as the efficient heat management of die casting…

流体动力学 · 物理学 2023-08-22 Farshad Navah , Marc-Etienne Lamarche-Gagnon , Florin Ilinca

An overview on recent developments in thermal interfaces is given with a focus on a novel thermal interface technology that allows the formation of 2-3 times thinner bondlines with strongly improved thermal properties at lower assembly…

综合物理 · 物理学 2008-01-08 R. Linderman , T. Brunschwiler , B. Smith , B. Michel

Introducing hierarchical disorder from multiple defects into materials through nanostructuring is one of the most promising directions to achieve extremely low thermal conductivities and thus improve thermoelectric performance. The success…

材料科学 · 物理学 2019-09-16 Laura de Sousa Oliveira , Vassilios Vargiamidis , Neophytos Neophytou

By using a first-principles approach, monolayer PbI$_2$ is found to have great potential in thermoelectric applications. The linear Boltzmann transport equation is applied to obtain the perturbation to the electron distribution by different…

材料科学 · 物理学 2021-05-24 Bo Peng , Haodong Mei , Hao Zhang , Hezhu Shao , Ke Xu , Gang Ni , Qingyuan Jin , Costas M. Soukoulis , Heyuan Zhu

Both superconductivity and thermoelectricity offer promising prospects for daily energy efficiency applications. The advancements of thermoelectric materials have led to the huge improvement of the thermoelectric figure of merit in the past…

The thermal conductivity of Functionally Graded Materials (FGMs) can be efficiently designed through topology optimization to obtain thermal meta-structures that actively steer the heat flow. Compared to conventional analytical design…

计算工程、金融与科学 · 计算机科学 2024-12-04 Chintan Jansari , Stéphane P. A. Bordas , Marco Montemurro , Elena Atroshchenko

Thermoelectric properties of Half Heusler alloys are predicted by adopting an ensemble modelling approach, specifically the stacking model integrated using Random Forest and XGBoost scheme. Leveraging a diverse dataset encompassing thermal…

材料科学 · 物理学 2024-08-02 Vipin K. E , Prahallad Padhan

Nothing is known about the thermal conductivity in twisted bilayer graphene (TBG) at small twist angles, and how it approaches its aligned value as the twist angle approaches 0 degrees. To provide insight into these questions, we perform…

计算物理 · 物理学 2019-11-19 Chenyang Li , Roger K. Lake

Controlling the thermal conductivity of semiconductors is of practical interest in optimizing the performance of thermoelectric and phononic devices. The insertion of inclusions of nanometer size in a semiconductor is an effective means of…

We investigate the thermal conductivity of plumbene using molecular dynamics simulations, overcoming existing limitations by optimizing the parameters of Tersoff and Stillinger-Weber potentials via artificial neural networks. Our findings…

材料科学 · 物理学 2023-11-20 Rafat Mohammadi , Behrad Karimi , John Kieffer , Daniel Hashemi

We propose an efficient scheme, which combines density functional theory (DFT) with deep potentials (DP), to systematically study the convergence issues of the computed electronic thermal conductivity of warm dense Al (2.7 g/cm$^3$,…

计算物理 · 物理学 2024-06-19 Qianrui Liu , Junyi Li , Mohan Chen

With the advances in materials and integration of electronics and thermoelectrics, the demand for novel crystalline materials with ultimate high/low thermal conductivity is increasing. However, search for optimal thermal materials is…

应用物理 · 物理学 2022-04-27 Shenghong Ju , Junichiro Shiomi

Predicting nanoscale thermal transport in dielectrics requires models, such as the Boltzmann transport equation (BTE), that account for phonon boundary scattering in structures with complex geometries. Although the BTE has been validated…

材料科学 · 物理学 2023-08-03 S. Aria Hosseini , Alex Greaney , Giuseppe Romano

Several models of thermionic energy nanoconverters have been proposed to study the transport phenomena that take place in electronic devices. For example, in resonant tunneling junctions those phenomena are manifested through the…

介观与纳米尺度物理 · 物理学 2020-06-02 G. Valencia-Ortega , L. A. Arias-Hernandez

The nanoparticle packed bed (NPB) as a kind of promising thermal insulation materials has drawn widely concern because of their quite low thermal conductivities (k). In this paper, based on the concept that NPB morphology enable low k, we…

应用物理 · 物理学 2020-01-15 Zizhen Lin , Congliang Huang

High-entropy alloys (HEAs) are at the focus of current research for their diverse properties, including superconductivity and structural polymorphism. However, the polymorphic transition has been observed only in nonsuperconducting HEAs and…

超导电性 · 物理学 2020-01-16 Jifeng Wu , Bin Liu , Yanwei Cui , Qinqing Zhu , Guorui Xiao , Hangdong Wang , Siqi Wu , Guang-han Cao , Zhi Ren

Thermoelectric materials intrigue much interest due to their wide range of application such as power generators and refrigerators. The efficiency of thermoelectric materials is quantified by the figure of merit, and a figure greater than…

介观与纳米尺度物理 · 物理学 2022-02-16 Masashi Hosoi , Ikuma Tateishi , Hiroyasu Matsuura , Masao Ogata

Interfacial thermal resistance arises challenges for the thermal management as the modern semiconductors are miniatured to nanoscale. Previous studies found that graded mass distribution in interface can maximumly enhance the interfacial…

材料科学 · 物理学 2023-06-28 Lina Yang , Baosheng Yang , Baowen Li

We evaluate the impact of acoustic Mie resonance in nanoparticles on the thermal conductivity of semiconductor and polymer composites. By appropriately choosing the bulk modulus and density, and selecting the size of the nanoparticle to…

介观与纳米尺度物理 · 物理学 2021-12-08 Brian Slovick , Srini Krishnamurthy

Features of thermal transport in multilayered porous silicon nanostructures are considered. Such nanostructures were fabricated by electrochemical etching of monocrystalline Si substrates by applying periodically changed current density.…