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Interfaces impede heat flow in micro/nanostructured systems. Conventional theories for interfacial thermal transport were derived based on bulk phonon properties of the materials making up the interface without explicitly considering the…

Increased power density in modern microelectronics has led to thermal management challenges which can cause degradation in performance and reliability. In many high-power electronic devices, the power consumption and heat removal are…

介观与纳米尺度物理 · 物理学 2019-10-01 David B. Brown , Thomas L. Bougher , Xiang Zhang , Pulickel Ajayan , Baratunde A. Cola , Satish Kumar

SiC is a promising substrate for Si-on-insulator (SOI) wafers for efficient thermal management owing to its high thermal conductivity and large bandgap. However, fabricating a Si device layer on a SiC substrate with a high and uniform…

材料科学 · 物理学 2024-06-26 Rulei Guo , Bin Xu , Fengwen Mu , Junichiro Shiomi

Understanding the physical processes involved in interfacial heat transfer is critical for the interpretation of thermometric measurements and the optimization of heat dissipation in nanoelectronic devices that are based on transition metal…

介观与纳米尺度物理 · 物理学 2021-01-12 Zhun-Yong Ong , Yongqing Cai , Gang Zhang , Yong-Wei Zhang

We present a formulation of a nonequilibrium Green's function method for thermal current in nanojunction atomic systems with nonlinear interactions. This first-principle approach is applied to the calculation of the thermal conductance in…

介观与纳米尺度物理 · 物理学 2007-05-23 Jian-Sheng Wang , Jian Wang , Nan Zeng

Topological phononic insulators are the counterpart of three-dimensional quantum spin Hall insulators in phononic systems and, as such, their topological surfaces are characterized by Dirac cone-shaped gapless edge states arising as a…

超导电性 · 物理学 2022-08-17 Daniele Di Miceli , Chandan Setty , Alessio Zaccone

The interface of two solids in contact introduces a thermal boundary resistance (TBR), which is challenging to measure from experiments. Besides, if the interface is reactive, it can form an intermediate recrystallized or amorphous region,…

The development of electronic devices, especially those that involve heterogeneous integration of materials, has led to increased challenges in addressing their thermal operational-temperature demands. The heat flow in these systems is…

Thermal resistances from interfaces impede heat dissipation in micro/nanoscale electronics, especially for high-power electronics. Despite the growing importance of understanding interfacial thermal transport, advanced thermal…

Efficient heat dissipation to the substrate is crucial for optimal device performance in nanoelectronics. We develop a theory of electronic thermal boundary conductance (TBC) mediated by remote phonon scattering for the single-layer…

介观与纳米尺度物理 · 物理学 2020-09-28 Zhun-Yong Ong , Gang Zhang , Linyou Cao , Yong-Wei Zhang

The phonon contribution to the thermal conductivity at low temperature in superconductors with line nodes is calculated assuming that scattering by both nodal quasiparticles and the sample boundaries is significant. It is determined that,…

超导电性 · 物理学 2007-05-23 M. F. Smith

Understanding the ideal limit of interfacial thermal conductance (ITC) across semiconductor heterointerfaces is crucial for optimizing heat dissipation in practical applications. By employing a highly accurate and efficient machine-learned…

材料科学 · 物理学 2025-04-28 Xiaonan Wang , Xin Wu , Penghua Ying , Zheyong Fan , Huarui Sun

We present systematic thermal conductivity measurements of suspended thin graphite ribbons, 234-527 nm thick, using a four-probe 3-omega method. Unlike recent reports of phonon hydrodynamics and exceptionally high thermal conductivity in…

介观与纳米尺度物理 · 物理学 2025-09-16 Wonjae Jeon , Yu Pei , Xun Li , Lucas Lindsay , Sangyeop Lee , Renkun Chen

Using the operational framework of completely positive, trace preserving operations and thermodynamic fluctuation relations, we derive a lower bound for the heat exchange in a Landauer erasure process on a quantum system. Our bound comes…

量子物理 · 物理学 2015-02-11 John Goold , Mauro Paternostro , Kavan Modi

The wave-like nature of electrons leads to the existence of upper bounds on the thermoelectric response of nanostructured devices [R. S. Whitney, Phys. Rev. Lett. 112, 130601 (2014); Phys. Rev. B 91, 115425 (2015)]. This fundamental result,…

介观与纳米尺度物理 · 物理学 2022-08-24 Giuseppe Bevilacqua , Alessandro Cresti , Giuseppe Grosso , Guido Menichetti , Giuseppe Pastori Parravicini

Interfacial thermal transport is critical for many thermal-related applications such as heat dissipation in electronics. While the total interfacial thermal conductance (ITC) can be easily measured or calculated, the ITC spectral mapping…

材料科学 · 物理学 2022-10-26 Yixin Xu , Lina Yang , Yanguang Zhou

We study heat conduction in a one-dimensional {finite}, unpinned chain of atoms perturbed by stochastic momentum exchange and coupled to Langevin heat baths at {possibly} distinct temperatures placed at the endpoints of the chain. While…

数学物理 · 物理学 2025-12-05 Tomasz Komorowski , Stefano Olla

Periodically driven coherent conductors provide a universal platform for the development of quantum transport devices. Here, we lay down a comprehensive theory to describe the thermodynamics of these systems. We first focus on moderate…

介观与纳米尺度物理 · 物理学 2021-04-15 Elina Potanina , Christian Flindt , Michael Moskalets , Kay Brandner

Coherent twin boundaries form periodic lamellar twinning in a wide variety of semiconductor nanowires, and are often viewed as near-perfect interfaces with reduced phonon and electron scattering behaviors. Such unique characteristics are of…

材料科学 · 物理学 2016-05-25 Aaron Porter , Chan Tran , Frederic Sansoz

An anisotropic lattice anomaly near the superconducting transition temperature, Tc, was observed in MgB2 by high-resolution neutron powder diffraction. The a-axis thermal expansion becomes negative near Tc, while the c-axis thermal…

超导电性 · 物理学 2007-05-23 J. D. Jorgensen , D. G. Hinks , P. G. Radaelli , W. I. F. David , R. M. Ibberson