相关论文: Inductance extraction of superconductor structures…
This paper proposes a three-dimensional (3D) communication channel model for an indoor environment considering the effect of the Hypersurface. The Hypersurface is a software controlled intelligent metasurface, which can be used to…
This work considers communication networks where individual links can be described as MIMO channels. Unlike orthogonal modulation methods (such as the singular-value decomposition), we allow interference between sub-channels, which can be…
The structure of a proximity induced vortex core in a two-dimensional (2D) metallic layer covering a superconducting half-space is calculated. We predict formation of a multiple vortex core characterized by two-scale behavior of the local…
We investigate the current-voltage characteristics of high-transparency superconductor-insulator-normal metal (SIN) junctions with the specific tunnel resistance below 30 kOhm per square micron. The junctions were fabricated from different…
We investigate the perturbation dynamics in a supersonic shear layer using a combination of large-eddy simulations (LES) and linear-operator-based input-output analysis. The flow consists of two streams-a main stream (Mach 1.23) and a…
We describe a new biasing scheme for single photon detectors based on superconducting tunnel junctions. It replaces a single detector junction with a circuit of three junctions and achieves biasing of a detector junction at subgap currents…
A long-standing challenge is designing multi-scale structures with good connectivity between cells while optimizing each cell to reach close to the theoretical performance limit. We propose a new method for direct multi-scale topology…
We introduce a new numerical technique, namely triangular tessellation, to calculate the free energy associated with the adsorption of a colloidal particle at a flat interface. The theory and numerical scheme presented here are sufficiently…
Interband quantum tunneling of electrons in semiconductors is of intense recent interest as the underlying transport mechanism in tunneling field-effect transistors. Such transistors can potentially perform electronic switching with lower…
The process of current filamentation in permanently externally driven, initially globally ideal plasmas is investigated by means of two-dimensional Magnetohydrodynamic (MHD)-simulations. This situation is typical for astrophysical systems…
Recently, deep learning-based compressive imaging (DCI) has surpassed the conventional compressive imaging in reconstruction quality and faster running time. While multi-scale has shown superior performance over single-scale, research in…
In time division duplexing (TDD) millimeter wave (mmWave) massive multiple-input multiple-output (MIMO) systems, downlink channel state information (CSI) can be obtained from uplink channel estimation thanks to channel reciprocity. However,…
Electromagnetic simulations of complex geologic settings are computationally expensive. One reason for this is the fact that a fine mesh is required to accurately discretize the electrical conductivity model of a given setting. This…
We present a novel formulation to calculate transport through disordered superconductors connected between two metallic leads. An exact expression for the current is derived, and is applied to a superconducting sample described by the…
Consumer-level multi-material 3D printing with conductive thermoplastics enables fabrication of interactive elements for bespoke tangible devices. However, large feature sizes, high resistance materials, and limitations of printable control…
Based on the Manhattan World assumption, most existing indoor layout estimation schemes focus on recovering layouts from vertically compressed 1D sequences. However, the compression procedure confuses the semantics of different planes,…
The surface of a 3D topological insulator is conducting and the topologically nontrivial nature of the surface states is observed in experiments. It is the aim of this paper to review and analyze experimental observations with respect to…
Conventionally, 3-dimensional cellular tomography can be done with light sheet or multi-angle observations. Recently, a new technique was introduced where the cell was rotated using convection currents to visualize the outer periphery (Liu…
The semiconductor industry's rapid advancement pushes conventional two-dimensional technology to its utmost limitations in terms of scaling, performance, and cost factors. These challenges drive the usage of 3D technology in the production…
With continuous progression of Moore's Law, integrated circuit (IC) device complexity is also increasing. Scanning Electron Microscope (SEM) image based extensive defect inspection and accurate metrology extraction are two main challenges…