相关论文: Three Dimensionial Surface Modelling: A Novel Anal…
For over 40 years lithographic silicon scaling has driven circuit integration and performance improvement in the semiconductor industry. As silicon scaling slows down, the industry is increasingly dependent on IC package technologies to…
We reconstruct a 3D model of the surface of a material undergoing fatigue testing and experiencing cracking. Specifically we reconstruct the surface depth (out of plane intrusions and extrusions) and lateral (in-plane) motion from multiple…
3D die stacking and 2.5D interposer design are promising technologies to improve integration density, performance and cost. Current approaches face serious issues in dealing with emerging security challenges such as side channel attacks,…
We demonstrate a motion-free intensity diffraction tomography technique that enables direct inversion of 3D phase and absorption from intensity-only measurements for weakly scattering samples. We derive a novel linear forward model,…
The semiconductor industry is reaching a fascinating confluence in several evolutionary trends that will likely lead to a number of revolutionary changes in the design, implementation, scaling, and the use of computer systems. However,…
To improve transistor density and electronic performance, next-generation semiconductor devices are adopting three-dimensional architectures and feature sizes down to the few-nm regime, which require atomic-scale metrology to identify and…
With continuous progression of Moore's Law, integrated circuit (IC) device complexity is also increasing. Scanning Electron Microscope (SEM) image based extensive defect inspection and accurate metrology extraction are two main challenges…
Modern semiconductor integrated circuits are increasingly fabricated at untrusted third party foundries. There now exist myriad security threats of malicious tampering at the hardware level and hence a clear and pressing need for new tools…
Optical metasurfaces performing analog image processing - such as spatial differentiation and edge detection - hold the potential to reduce processing times and power consumption, while avoiding bulky 4F lens systems. However, current…
Diffraction tomography (DT) has been widely explored in transmission-mode configurations, enabling high-resolution, label-free 3D imaging. However, industrial metrology applications, such as semiconductor inspection, typically involve…
The application of computer vision and machine learning methods in the field of additive manufacturing (AM) for semantic segmentation of the structural elements of 3-D printed products will improve real-time failure analysis systems and can…
Many nano and quantum devices, with their sizes often spanning from millimeters down to sub-nanometer, have intricate low-dimensional, non-uniform, or hierarchical structures on surfaces and interfaces. Since their functionalities are…
Dark Field X-ray Microscopy (DFXM) is a full-field imaging technique for non-destructive 3D mapping of orientation and strain in crystalline elements. The new DFXM beamline at ID03, developed as part of the ESRF Phase II Upgrade Project…
The latest sheet stamping processes enable efficient manufacturing of complex shape structural components that have high stiffness to weight ratios, but these processes can introduce defects. To assist component design for stamping…
Understanding mechanical properties of materials requires not only complete determination of the three-dimensional response at a local scale, but also knowledge of the mode or the mechanism by which deformation takes place. Probing…
The microscopic distribution of strain and stress plays a crucial role for the performance, safety, and lifetime of components in aeronautics, automotive and critical infrastructure [1]. While non-destructive methods for measuring the…
This paper provides a novel approach to stitching surface images of rotationally symmetric parts. It presents a process pipeline that uses a feature-based stitching approach to create a distortion-free and true-to-life image from a video…
Additive manufacturing (AM) is an emerging digital manufacturing technology to produce complex and freeform objects through a layer-wise deposition. High deposition rate robotic AM (HDRRAM) processes, such as cold spray additive…
Dark-field X-ray Microscopy (DFXM) is a novel diffraction-based imaging technique that non-destructively maps the local deformation from crystalline defects in bulk materials. While studies have demonstrated that DFXM can spatially map 3D…
The way of reduction of metal oxyde semiconductor (MOS) structures is going to reach limitations and new devices have to be explored as an alternative to MOS technology. Molecular electronic and more particularly self-assembly-molecular…