相关论文: SLID-ICV Vertical Integration Technology for the A…

Critical research about camera-and-LiDAR-based semantic object segmentation for autonomous driving significantly benefited from the recent development of deep learning. Specifically, the vision transformer is the novel ground-breaker that…

Recently, silicon nitride (Si3N4) photonic integrated circuits (PICs) are of a great interest due to their extremely low waveguides losses. The number of Si3N4 integrated photonics platform applications is constantly growing including the…

A detector concept based on hybrid planar pixel-detector technology is under development for the CLIC vertex detector. It comprises fast, low-power and small-pitch readout ASICs implemented in 65 nm CMOS technology (CLICpix) coupled to…

Vertically integrated (3D) combinations of sensors and electronics provide the ability to fabricate small, fine pitch pixels with very small total capacitance monolithically integrated with complex circuitry. The small capacitance, enabled…

In recent years, great progress has been made in the Lift-Splat-Shot-based (LSS-based) 3D object detection method. However, inaccurate depth estimation remains an important constraint to the accuracy of camera-only and multi-model 3D object…

We present a development of the ALFRED framework that includes support for the IPbus protocol, created for the Fast Interaction Trigger (FIT) detector in the ALICE experiment at CERN. This modification resolves the incompatibility between…

In view of the LHC upgrade phases towards HL-LHC, the ATLAS experiment plans to upgrade the Inner Detector with an all-silicon system. The n-on-p silicon technology is a promising candidate for the pixel upgrade thanks to its radiation…

A monolithic pixel sensor in deep-submicron Silicon-On-Insulator (SOI) CMOS technology has been designed, manufactured and characterised. This technology is of significant interest for applications in particle tracking and imaging. The…

The ALICE ITS3 is a novel vertex detector replacing the innermost layers of ITS2 during LS3. Composed of three truly cylindrical layers of wafer-sized 65 nm stitched Monolithic Active Pixel Sensors, ITS3 provides high-resolution tracking of…

The upcoming ATLAS Phase II upgrade mandates replacing the tracking system with the all-silicon Inner Tracker (ITK), featuring a pixel detector as its core element. The monitoring data of the new system will be aggregated from an…

The official data collection for the Run 3 of the Large Hadron Collider (LHC) at CERN in Geneva commenced on July 5, 2022, following approximately three and a half years of maintenance, upgrades, and commissioning. Among the many upgrades…

Achieving pixel-level segmentation with low computational cost using multimodal data remains a key challenge in crack segmentation tasks. Existing methods lack the capability for adaptive perception and efficient interactive fusion of…

We have developed a prototype system for the ILC vertex detector based on DEPFET pixels. The system operates a 128x64 matrix (with ~35x25 square micron large pixels) and uses two dedicated microchips, the SWITCHER II chip for matrix…

This paper proposes a novel UAV-to-Vehicle (U2V) channel model for sixth-generation (6G) intelligent sensing-communication integration, based on three-dimensional (3D) scatterer prediction. To explore the mapping relationship between…

The hybrid pixel detectors used in the high energy physics experiments currently under construction use a three dimensional connection technique, the so-called bump bonding. As the pitch below 100um, required in these applications, cannot…

Image Splicing Localization (ISL) is a fundamental yet challenging task in digital forensics. Although current approaches have achieved promising performance, the edge information is insufficiently exploited, resulting in poor integrality…

Light-emitting diodes (LEDs) can bridge the gap between narrow linewidth, expensive lasers and broadband, inefficient thermal globars for low-cost chemical sensing in the mid-infrared (mid-IR). However, the efficiency of III-V based mid-IR…

The fusion of infrared and visible images is essential in remote sensing applications, as it combines the thermal information of infrared images with the detailed texture of visible images for more accurate analysis in tasks like…

In view of the LHC upgrade phases towards the High Luminosity LHC (HL-LHC), the ATLAS experiment plans to upgrade the Inner Detector with an all-silicon system. Because of its radiation hardness and cost effectiveness, the n-on-p silicon…

The development of n-on-p "edgeless" planar pixel sensors being fabricated at FBK (Trento, Italy), aimed at the upgrade of the ATLAS Inner Detector for the High Luminosity phase of the Large Hadron Collider (HL-LHC), is reported. A…