相关论文: Ultrafast Temperature Profile Calculation in Ic Ch…
This study explores the impact of temperature on defect dynamics in tungsten, emphasizing its application in nuclear fusion reactors as Plasma Facing Components (PFCs). Through atomistic simulations, the research elucidates the intricate…
Controlling the temperature distribution inside catalytic fixed bed reactors is crucial for yield optimization and process stability. Yet, in situ temperature measurements with spatial and temporal resolution are still challenging. In this…
In the near future, a major challenge in quantum computing is to scale up robust qubit prototypes to practical problem sizes and to implement comprehensive error correction for computational precision. Due to inevitable quantum…
A stochastic inverse heat transfer problem is formulated to infer the transient heat flux, treated as an unknown Neumann boundary condition. Therefore, an Ensemble-based Simultaneous Input and State Filtering as a Data Assimilation…
Thermionic emission has been exploited to give rise to the theory of thermionic cooling also known as electron transpiration cooling, which can potentially serve as a powerful and engineerable cooling mode for hypersonic leading edges that…
Irradiation of cuprate high-$T_c$ superconductors with light ions of moderate energy creates point defects that lead to a reduction or full suppression of the critical temperature. By shaping the ion flux with a stencil mask, nanostructures…
We present a simple experiment on thermal diffusion in metal rods that can be used to integrate computation into the advanced lab. An analytical solution exists for the transient heat conduction in an infinite rod with a delta function heat…
The semiconductor industry is reaching a fascinating confluence in several evolutionary trends that will likely lead to a number of revolutionary changes in the design, implementation, scaling, and the use of computer systems. However,…
3D integration technologies are seeing widespread adoption in the semiconductor industry to offset the limitations and slowdown of two-dimensional scaling. High-density 3D integration techniques such as face-to-face wafer bonding with…
Power and thermal management are critical components of High-Performance-Computing (HPC) systems, due to their high power density and large total power consumption. The assessment of thermal dissipation by means of compact models directly…
We develop a fast technique based on the generalized slow roll (GSR) approach for computing the curvature bispectrum of inflationary models with features. We show that all triangle configurations can be expressed in terms of three simple…
We present an efficient method for evaluating random phase errors in phase shifters within photonic integrated circuits, avoiding the computational cost of traditional Monte Carlo simulations. By modeling spatially correlated manufacturing…
The increase in dissipated power per unit area of electronic components sets higher demands on the performance of the heat sink. Also if we continue at our current rate of miniaturisation, laptops and other electronic devices can get heated…
The thermal characteristics of silicon between 15 and 300 deg K are investigated by applying a computer program on the solution of the differential heat diffusion equation. The computer model is linked to high-purity silicon through a set…
In the collisionless plasmas of radiatively inefficient accretion flows, heating and acceleration of ions and electrons is not well understood. Recent studies in the gyrokinetic limit revealed the importance of incorporating both the…
In this paper we evaluate the use of system identification methods to build a thermal prediction model of heterogeneous SoC platforms that can be used to quickly predict the temperature of different configurations without the need of…
A scheme for measuring complex temperature partition functions of Ising models is introduced. In the context of ordered qubit registers this scheme finds a natural translation in terms of global operations, and single particle measurements…
Hot-spots are considered among the unavoidable consequences of the high integration density of 3D-ICs. Eliminating hot spots requires employing efficient cooling techniques. Using embedded channels, liquid cooling systems can be designed to…
Modern CPUs with increasing core frequency and power are rapidly reaching a point where the CPU frequency and performance are limited by the amount of heat that can be extracted by the cooling technology. In mobile environment, this issue…
Heat transfer and dissipation exists in almost any physical, chemical or biological systems. Cells, as the basic unit of life, undergo continuous heat transfer and dissipation during their metabolism. The heat transfer and dissipation…