相关论文: Ultrafast Temperature Profile Calculation in Ic Ch…
A switching-off process very similar to those in real high-voltage self-blast circuit-breakers is emulated in a model chamber to study the arc properties by optical emission spectroscopy. The arc is operated in a chamber filled with SF$_6$…
Modern multiprocessor system-on-chips (SoCs) integrate multiple heterogeneous cores to achieve high energy efficiency. The power consumption of each core contributes to an increase in the temperature across the chip floorplan. In turn,…
We developed an inductive energy participation ratio (IEPR) method and a streamlined procedure for simulating and verifying superconducting quantum chips. These advancements are increasingly vital in the context of large-scale,…
Computing-in-Memory (CiM) is a promising paradigm to address the memory bottleneck constraining traditional systems. Most power-efficient CiM variants can directly perform Boolean operations in non-volatile memory arrays. Higher…
Temperature gradients developed at ultra-high temperatures create a challenge for temperature measurements that are required for material processing. At ultra-high temperatures, the components of the system can react and change phases…
Modern multicore System-on-Chips (SoCs) feature hardware monitoring mechanisms that measure total power consumption. However, these aggregate measurements are often insufficient for fine-grained thermal and power management. This paper…
Coarse Grid Projection (CGP) methodology is used to accelerate the computations of sets of decoupled nonlinear evolutionary and linear static equations. In CGP, the linear equations are solved on a coarsened mesh compared to the nonlinear…
Melting is a high temperature process that requires extensive sampling of configuration space, thus making melting temperature prediction computationally very expensive and challenging. Over the past few years, I have built two methods to…
Photonic integrated circuits play an important role in the field of optical computing, promising faster and more energy-efficient operations compared to their digital counterparts. This advantage stems from the inherent suitability of…
Thermal analysis is increasingly critical in modern integrated circuits, where non-uniform power dissipation and high transistor densities can cause rapid temperature spikes and reliability concerns. Traditional methods, such as FEM-based…
We introduce and experimentally validate a new macro-level model of the CPU temperature/power relationship within nanometer-scale application processors or system-on-chips. By adopting a holistic view, this model is able to take into…
3D integrated circuit (3D-IC) technology gained acceptance due to the ability to achieve extremely high level of integration, where hundreds of ICs are stacked vertically. Such level of integration can result in local power dissipation of…
By combining Three Dimensional Integrated Circuits with the Network-on-Chip infrastructure to obtain 3D Networks-on-Chip (3D-NoCs), the new on-chip communication paradigm brings several advantages on lower power, smaller footprint and lower…
Despite temperature rise being a first-order design constraint, traditional thermal estimation techniques have severe limitations in modeling critical aspects affecting the temperature in modern-day chips. Existing thermal modeling…
In this paper we study the thermal effective behaviour for 3D multiphase composite material consisting of three isotropic phases which are the matrix, the inclusions and the coating media. For this purpose we use an accelerated FFT-based…
Existing algorithms with iterations as the principle for 3D inverse heat conduction problems (IHCPs) are usually time-consuming. With the recent advancements in deep learning techniques, it is possible to apply the neural network to compute…
The thermal sensitive electrical parameter (TSEP) method is crucial for enhancing the reliability of power devices through junction temperature monitoring. The TSEP method comprises three key processes: calibration, regression, and…
In context of laser powder bed fusion (L-PBF), it is known that the properties of the final fabricated product highly depend on the temperature distribution and its gradient over the manufacturing plate. In this paper, we propose a novel…
We present a new method for calculating the temperature profile in high explosive (HE) material using a Convolutional Neural Network (CNN). To train/test the CNN, we have developed a hybrid experiment/simulation method for collecting…
This work builds on the previous introduction [1] of a coupled experimental-computational system devised to fully characterize the thermal behavior of complex 3D submicron electronic devices. The new system replaces the laser-based surface…