质量控制导致的质量问题——热循环测试中硅条探测器模块的变形
高能物理 - 实验
2025-03-06 v1 仪器与探测器
摘要
ATLAS实验正在为其高亮度升级（HL-LHC）准备替换当前的内探测器（ID）为升级版的全硅内跟踪器（ITk）。ITk将由中心像素跟踪器和外部条形跟踪器组成，约包含19,000个条形探测器模块。每个条形模块由最多两个传感器和最多五个柔性板组成，经历一系列粘合、线束和质量控制步骤组装而成。在探测器运行期间，模块将被冷却至约-35°C的温度（对应于其将安装的支撑结构的温度），此前在室温下进行初始组装和储存。为确保与探测器运行温度范围的兼容性，模块在质量控制过程中进行热循环测试。每个模块进行10次在-35°C和+40°C之间的循环，并在每个高低温点进行完整的电气特征测试。作为对模块在冷却过程中所受应力的调查，发现模块在热循环前后通常会出现形状变化。本文总结了该现象的发现与理解，关联其与模块应力增长的关系，以及随之而来的模块热循环程序修改。
引用
@article{arxiv.2503.03133,
title = {Quality Concerns Caused by Quality Control -- deformation of silicon strip detector modules in thermal cycling tests},
author = {Richard Salami and Luise Poley and Kirsten Affolder and Tony Affolder and Lukas Bayer and Ben Crick and Emily Duden and Ian George Dyckes and Vitaliy Fadeyev and Anne Fortman and Pavol Federic and Laura Franconi and Matthew Gignac and Shubham Gupta and John Hallford and Cole Helling and Ewan Hill and Miao Hu and Jiri Kroll and Priyanka Kumari and Carlos Lacasta and Madison Levagood and Hanlez Lopez and Len Morelos-Zaragoza and Meny Raviv Moshe and Aaron Petersen and Vicente Platero and Archa Devi Rajagopalan and Lisa Sitnikova and Carles Solaz and Urmila Soldevila and Peter Speers and Gerrit Van Nieuwenhuizen and Alex Zeng Wang},
journal= {arXiv preprint arXiv:2503.03133},
year = {2025}
}