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Pixel sensors based on commercial high-voltage CMOS processes are an exciting technology that is considered as an option for the outer layer of the ATLAS inner tracker upgrade at the High Luminosity LHC. Here, charged particles are detected…
This paper describes an experimental setup that has been developed to measure and characterise properties of Silicon Photomultipliers (SiPM). The measured SiPM properties are of general interest for a multitude of potential applications and…
Some applications in scientific imaging, like space-based high-precision photometry, benefit from a detailed characterization of the sensitivity variation within a pixel. A detailed map of the intra-pixel sensitivity (IPS) allows to…
We report on the 3-year INFN ATLAS-CMS joint research activity in collaboration with FBK, started in 2014, and aimed at the development of new thin pixel detectors for the High Luminosity LHC Phase-2 upgrades. The program is concerned with…
As a prototype detector for the SHiP Surrounding Background Tagger (SBT), we constructed a cell (120 cm x 80 cm x 25 cm) made from corten steel that is filled with liquid scintillator (LS) composed of linear alkylbenzene (LAB) and…
The CLIC Tracker Detector (CLICTD) is a monolithic pixel sensor featuring pixels of 30um x 37.5um and a small collection diode. The sensor is fabricated in a 180 nm CMOS imaging process, using two different pixel flavours: the first with a…
Silicon photonics is being extended from the near-infrared (near-IR) window of 1.3-1.5 {\mu}m for optical fiber communications to the mid-infrared (mid-IR) wavelength-band of 2 {\mu}m or longer for satisfying the increasing demands in many…
We present our work to develop and characterize low thermal conductance bolometers that are part of sinuous antenna multi-chroic pixels (SAMP). We use longer, thinner and meandered bolometer legs to achieve 9 pW/K thermal conductance…
The next upgrade of the Large Hadron Collider (LHC) is planned from 2026 when the collider will move to its High Luminosity phase (HL-LHC). The CMS detector needs to be substantially upgraded during this period to exploit the fourfold…
We are now developing new X-ray imaging system by using Silicon-On-Insulator (SOI) Pixel Detectors. The SOI detector is a monolithic radiation imaging detector based on a 0.2um FD-SOI CMOS process. Special additional process steps are also…
The third-order non-linearity of silicon gives rise to a spontaneous four-wave mixing process in which correlated photon pairs are generated. Sources based on this effect can be used for quantum computation and cryptography, and can in…
In this paper, we describe the development of monolithic pixel detectors by using a Silicon-on-Insulator (SOI) technology for X-ray and charged particle applications. The detectors are based on a 0.2 {\mu}m CMOS fully depleted SOI process…
Micro-channel plate (MCP)-based photodetectors are capable of picosecond level time resolution and sub-mm level position resolution, which makes them a perfect candidate for the next generation large area photodetectors. The large-area…
The ATLAS Insertable B-Layer (IBL) is the innermost layer of pixel detectors, and was installed in May 2014 at a radius of 3.3 cm from the beam axis, between the existing Pixel detector and a new smaller radius beam-pipe. The new detector,…
The Large Hadron Collider (LHC) at CERN will undergo an upgrade in order to increase its luminosity to $7.5 \times 10^{34}$ cm$^{-2}$s$^{-1}$. The increased luminosity during this High-Luminosity running phase (HL-LHC), starting around…
A vacuum-compatible photon-counting hybrid pixel detector has been installed in the ultra-high vacuum (UHV) reflectometer of the four-crystal monochromator (FCM) beamline of the Physikalisch-Technische Bundesanstalt (PTB) at the electron…
Owing to their intrinsic (geometry dependent) radiation hardness, 3D pixel sensors are promising candidates for the innermost tracking layers of the forthcoming experiment upgrades at the Phase 2 High-Luminosity LHC (HL-LHC). To this…
Reliable integration of photonic integrated circuits (PICs) into quantum sensors has the potential to drastically reduce sensor size, ease manufacturing scalability, and improve performance in applications where the sensor is subject to…
For large scale applications, hybrid pixel detectors, in which sensor and read-out IC are separate entities, constitute the state of the art in pixel detector technology to date. They have been developed and start to be used as tracking…
The CMS pixel barrel system will consist of three layers built of about 800 modules. One module contains 66560 readout channels and the full pixel barrel system about 48 million channels. It is mandatory to test each channel for…