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Swift, high resolution CMOS pixel sensors are being developed for the ILC vertex detector, aiming to allow approaching the interaction point very closely. A major issue is the time resolution of the sensors needed to deal with the high…
A dedicated in-vacuum X-ray detector based on the hybrid pixel PILATUS 1M detector has been installed at the four-crystal monochromator beamline of PTB at the electron storage ring BESSY II in Berlin. Due to its windowless operation, the…
The Topmetal-M is a large area pixel sensor (18 mm * 23 mm) prototype fabricated in a new 130 nm high-resistivity CMOS process in 2019. It contains 400 rows * 512 columns square pixels with the pitch of 40 {\mu}m. In Topmetal-M, a novel…
Efficient thermal management is critical for ensuring the safety, performance, and durability of lithium ion pouch cells (LIPCs), particularly under high power operating conditions where conventional battery thermal management systems…
Laser powder bed fusion (LPBF) process can incur defects due to melt pool instabilities, spattering, temperature increase, and powder spread anomalies. Identifying defects through in-situ monitoring typically requires collecting, storing,…
Gas detector are very light instrument used in high energy physics to measure the particle properties: position and momentum. Through high electric field is possible to use the Gas Electron Multiplier (GEM) technology to detect the…
A high resolution vacuum ultraviolet (HRVUV) beamline based on a 6.65 meter off-plane Eagle spectrometer is in operation at the Indus-1 synchrotron radiation source, RRCAT, Indore, India. To facilitate position sensitive detection and fast…
The conventional high-level sensing techniques require high-fidelity images as input to extract target features, which are produced by either complex imaging hardware or high-complexity reconstruction algorithms. In this letter, we propose…
This paper presents the design and results of detailed tests of a CMOS active pixel chip for charged particle detection with in-pixel charge storage for correlated double sampling and readout in rolling shutter mode at frequencies up to 25…
We report on the development of new 3D pixel sensors for the Phase 2 Upgrades at the High-Luminosity LHC (HL-LHC). To cope with the requirements of increased pixel granularity (e.g., 50x50 or 25x100 um2 pixel size) and extreme radiation…
The CMS beam and radiation monitoring subsystem BCM1F (Fast Beam Condition Monitor) consists of 8 individual diamond sensors situated around the beam pipe within the pixel detector volume, for the purpose of fast bunch-by-bunch monitoring…
For its physics program with a high-intensity hadron beam of up to 2e7 particles/s, the COMPASS experiment at CERN requires tracking of charged particles scattered by very small angles with respect to the incident beam direction. While good…
The ATLAS experiment will undergo a major upgrade of the tracker system in view of the high luminosity phase of the LHC (HL-LHC) foreseen to start around 2025. Thin planar pixel modules are promising candidates to instrument the new pixel…
The experiment of the future electron-positron colliders has unprecedented requirements on the vertex resolution, such as around 3micron single point resolution for the inner most detector layer, with fast readout, and very low…
An estimated 26 million people in low- and middle-income countries are at risk of lead exposure and there is no safe threshold for lead ingestion. Radio assay methods are not easily accessible in regions at risk, therefore a low cost and…
Silicon pixel sensors manufactured using commercial CMOS processes are promising instruments for high-energy particle physics experiments due to their high yield and proven radiation hardness. As one of the essential factors for the…
This work presents a novel solution for the packaging of ALPIDE chips that facilitates non-planar assembly with a minimal material budget. This solution represents a technological advancement based on methodologies developed for the ALICE…
A hybrid pixel detector based on the concept of simultaneous charge integration and photon counting will be presented. The second generation of a counting and integrating X-ray prototype CMOS chip (CIX) has been operated with different…
Recently, black phosphorus (BP) has joined the two dimensional material family as a promising candidate for photonic applications, due to its moderate bandgap, high carrier mobility, and compatibility with a diverse range of substrates.…
Due to their radiation hardness, kilohertz frame rates, and high dynamic range, hybrid pixel detectors have recently expanded their application range to electron diffraction and recently also electron imaging. However, these detectors…