Related papers: Development of an Indium Bump Bond Process for Sil…
The demands on detectors for particle detection as well as for medical and astronomical X-ray imaging are continuously pushing the development of novel pixel detectors. The state of the art in pixel detector technology to date are hybrid…
High-performance programmable silicon photonic circuits are considered to be a critical part of next generation architectures for optical processing, photonic quantum circuits and neural networks. Low-loss optical phase change materials…
A new generation of Monolithic Active Pixel Sensors (MAPS), produced in a 65 nm CMOS imaging process, promises higher densities of on-chip circuits and, for a given pixel size, more sophisticated in-pixel logic compared to larger feature…
We present the characterization of a photon-number-resolving detection chain based on Silicon photomultipliers (SiPM) coupled to a 14 bit, 1 Gs\s digital acquisition system embedding an FPGA-based signal processing pipeline that performs…
We present a 'digital SiPM' photo-detection chip combining single photon sensitive avalanche photo diodes and CMOS readout electronics on a single die. The chip has a size of $8046\times9032\,\mu m^2$ with $72.5\%$ of photo sensitive area.…
The Skipper-in-CMOS image sensor integrates the non-destructive readout capability of Skipper Charge Coupled Devices (Skipper-CCDs) with the high conversion gain of a pinned photodiode in a CMOS imaging process, while taking advantage of…
Bump bonding is a superior assembly alternative compared to conventional wire bond techniques. It offers a highly reliable connection with greatly reduced parasitic properties. The Flip Chip on Board (FCOB) procedure is an especially…
As silicon detectors in high energy physics experiments require increasingly complex assembly procedures, the availability of a wide variety of interconnect technologies provides more options for overcoming obstacles in generic R&D. Gold…
High-speed generation and efficient entanglement detection on a photonic chip are essential for quantum information applications but hard to achieve due to common photonic chips' material properties and limited component performance. In…
Central exclusive processes can be studied in CMS by combining the information of the central detector with the Precision Proton Spectrometer (PPS). PPS detectors, placed symmetrically at more than 200 m from the interaction point, can…
The new generation internal beam dump of the Super Proton Synchrotron (SPS) at CERN will have to dissipate approximately 270 kW of thermal power, deposited by the primary proton beam. For this purpose, it is essential that the cooling…
A novel approach for designing the next generation of vertex detectors foresees to employ wafer-scale sensors that can be bent to truly cylindrical geometries after thinning them to thicknesses of 20-40$\mu$m. To solidify this concept, the…
The High Energy Photon Source (HEPS) represents a fourth-generation light source. This facility has made unprecedented advancements in accelerator technology, necessitating the development of new detectors to satisfy physical requirements…
Results on beam tests of 3D silicon pixel sensors aimed at the ATLAS Insertable-B-Layer and High Luminosity LHC (HL-LHC)) upgrades are presented. Measurements include charge collection, tracking efficiency and charge sharing between pixel…
Deep sub micron HV-CMOS processes offer the opportunity for sensors built by industry standard techniques while being HV tolerant, making them good candidates for drift-based, fast collecting, thus radiation-hard pixel detectors. For the…
We present a compact on-chip resonator enhanced silicon-MSM photodetector in $850$ $nm$ wavelength band for communication and lab-on-chip bio-sensing applications. We report the highest responsivity of 0.81 A/W for a 5 $\mu m$ long device.…
Additive manufacturing, particularly fused deposition modeling, is transforming modern production by enabling rapid prototyping and complex part fabrication. However, its layer-by-layer process remains vulnerable to faults such as nozzle…
Thin-film transistors composed of a hydrogen-containing indium oxide active layer are promising candidates for backplane devices in next-generation flat panel displays, offering higher definition and faster operation. However, the hydrogen…
Bioluminescence detection requires single-photon sensitivity, extremely low detection limits and wide dynamic range. Such performances were traditionally assured by photomultiplier-tubes based systems. However, development of novel…
In this work, photon bunching from LED light was observed for the first time using SiPMs. The bunching signature was observed with a significance of $7.3~\sigma$ using 97~hs of data. The light was spectrally filtered using a 1~nm bandpass…