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The development of CMOS pixel sensors with column parallel read-out and integrated zero-suppression has resulted in a full size, nearly 1 Megapixel, prototype with ~100 \mu s read-out time. Its performances are quite close to the ILD vertex…
Hybrid pixel detectors require a reliable and cost-effective interconnect technology adapted to the pitch and die sizes of the respective applications. During the ASIC and sensor R&D phase, and in general for small-scale applications, such…
The high energy physics community recently gained access to the TPSCo 65 nm ISC (Image Sensor CMOS), which enables a higher in-pixel logic density in monolithic active pixel sensors (MAPS) compared to processes with larger feature sizes. To…
The PCI diagnostic is an internal reference interferometer that creates an image of absolutely calibrated electron density fluctuations integrated along the line of sight of the probing light beam. While conventional PCI diagnostics…
The Phase-1 upgrade of the CMS pixel detector is built out of four barrel layers (BPix) and three forward disks in each endcap (FPix). It comprises a total of 124M pixel channels in 1,856 modules, and it is designed to withstand…
The current CMS silicon pixel detector as the innermost component of the CMS experiment is performing well at LHC design luminosity, but would be subject to severe inefficiencies at LHC peak luminosities of 2x10e34 cm^-2 s^-1. Therefore, an…
High-performance infrared photodetection underpins various applications spanning surveillance, environmental monitoring, optical communications and biomedical imaging. However, conventional bulk detectors remain limited by poor spectral…
The Silicon Electron Multiplier (SiEM) is a novel sensor concept for minimum ionizing particle (MIP) detection which uses internal gain and fine pitch to achieve excellent temporal and spatial resolution. In contrast to sensors where the…
The upgrade for ATLAS detector will undergo different phase towards super-LHC. The first upgrade for the Pixel detector will consist of the construction of a new pixel layer which will be installed during the first shutdown of the LHC…
CMOS Pixel Sensors are making steady progress towards the specifications of the ILD vertex detector. Recent developments are summarised, which show that these devices are close to comply with all major requirements, in particular the…
The CMS inner pixel detector system is planned to be replaced during the first phase of the LHC luminosity upgrade. The plans foresee an ultra low mass system with four barrel layers and three disks on either end. With the expected increase…
Sensors fabricated from high resistivity, float zone, silicon material have been the basis of vertex detectors and trackers for the last 30 years. The areas of these devices have increased from a few square cm to $\> 200\ m^2$ for the…
Pixel sensors using 8" CMOS processing technology have been designed and characterized offering the benefits of industrial sensor fabrication, including large wafers, high throughput and yield, as well as low cost. The pixel sensors are…
We present a conceptual design for a low-mass, all pixel vertex detector using the CMOS quadruple well INMAPS process, capable of working in the very high luminosities exceeding 10^36 /cm^2 /sec that can be expected at the next generation…
Multichip modules (MCM) with 4 single photon counting MPEC 2.3 chips bump bonded to 1.3 cm x 1.3 cm large CdTe and Si semiconductor sensors as well as to single chip pixel detectors have been successfully built and operated. The MPEC 2.3…
An upgrade of the ATLAS experiment for the High Luminosity phase of LHC is planned for 2024 and foresees the replacement of the present Inner Detector (ID) with a new Inner Tracker (ITk) completely made of silicon devices. Depleted active…
The CMS tracker consists of two tracking systems utilizing semiconductor technology: the inner pixel and the outer strip detectors. The tracker detectors occupy the volume around the beam interaction region between 3 cm and 110 cm in radius…
The reliability of bump connection structures has become a critical aspect of future silicon detectors for particle physics. The High Granularity Timing Detector (HGTD) for the ATLAS experiment at the High-Luminosity Large Hadron Collider…
The performance of novel n-in-p planar pixel detectors, designed for future upgrades of the ATLAS Pixel system is presented. The n-in-p silicon sensors technology is a promising candidate for the pixel upgrade thanks to its radiation…
To cope with the higher occupancy and radiation damage at the HL-LHC also the LHC experiments will be upgraded. The ATLAS Planar Pixel Sensor R&D Project (PPS) is an international collaboration of 17 institutions and more than 80…