Thermal Cycling Reliability of Hybrid Pixel Sensor Modules for The ATLAS High Granularity Timing Detector
Abstract
The reliability of bump connection structures has become a critical aspect of future silicon detectors for particle physics. The High Granularity Timing Detector (HGTD) for the ATLAS experiment at the High-Luminosity Large Hadron Collider will require 8032 hybrid pixel sensor modules, composed of two Low Gain Avalanche Diode sensors bump-bonded to two readout ASICs and glued to a passive PCB. The detector will operate at low temperature (-30 degrees Celsius) to mitigate the impact of irradiation. The thermomechanical reliability of flip-chip bump connections in HGTD modules is a critical concern, particularly due to their characteristically lower bump density (pixel pitch dimensions of 1.3 mm by 1.3 mm). This paper elaborates on the challenges arising from this design characteristic. Finite element analysis and experimental testing were employed to investigate failure modes in the flip-chip bump structures under thermal cycling from -45 degrees Celsius to 40 degrees Celsius and to guide the module redesign. The optimized design demonstrates significantly enhanced robustness and is projected to fulfill the full lifetime requirements of the HGTD.
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Cite
@article{arxiv.2509.14045,
title = {Thermal Cycling Reliability of Hybrid Pixel Sensor Modules for The ATLAS High Granularity Timing Detector},
author = {Y. Li and A. Aboulhorma and M. Ait Tamlihat and H. M. Alfanda and N. Atanov and O. Atanova and I. Azzouzi and J. Barreiro Guimarães Da Costa and T. Beau and D. Benchekroun and F. Bendebba and Y. Bimgdi and A. Blot and A. Boikov and J. Bonis and D. Boumediene and C. Brito and A. S. Brogna and A. M. Burger and L. Cadamuro and Y. Cai and N. Cartalade and R. Casanova Mohr and Y. Che and X. Chen and R. Cherkaoui El Moursli and E. Y. S. Chow and L. D. Corpe and C. G. Crozatier and L. D'Eramo and S. Dahbi and D. Dannheim and G. Daubard and Y. I. Davydov and C. de La Taille and J. Debevc and Y. Degerli and E. Delagnes and F. Deliot and M. Dhellot and G. Di Gregorio and P. Dinaucourt and P. J. Dos Santos De Assis and C. Duan and O. Duarte and F. Dulucq and J. Ehrecke and Y. El Ghazali and A. El Moussaouy and R. Estevam and A. Falou and L. Fan and Z. Fan and Y. Fan and K. Farman and F. Fassi and Y. Feng and M. Ferreira and F. Filthaut and F. Fischer and J. Fu and P. Fusté and G. Gaspar De Andrade and Z. Ge and R. Gonçalo and M. Gouighri and S. Grinstein and K. Gritsay and F. Guilloux and S. Guindon and A. Haddad and S. E. D. Hammoud and L. Han and A. M. Henriques Correia and M. Hidaoui and B. Hiti and J. Hofner and S. Hou and P. J. Hsu and K. Hu and Y. Huang and X. Huang and C. Insa and J. Jeglot and X. Jia and G. Kramberger and M. Kuriyama and B. Y. Ky and D. Lacour and A. Lafarge and B. Lakssir and A. Lantheaume and D. Laporte and A. Leopold and M. Li and S. Li and L. Li and S. Li and H. Li and Z. Li and Z. Liang and S. Liang and M. A. Lisboa Leite and B. Liu and Y. L. Liu and K. Liu and K. Liu and Y. W. Liu and M. Lu and Y. J. Lu and F. L. Lucio Alves and F. Lyu and X. Ma and K. Ma and D. Macina and R. Madar and N. Makovec and S. Malyukov and I. Mandić and T. Manoussos and S. Manzoni and G. Martin-Chassard and F. Martins and L. Masetti and R. Mazini and E. Mazzeo and R. Menegasso and J. -P. Meyer and Y. Miao and A. Migayron and M. Mihovilovic and M. Milovanovic and M. Missio and V. Moskalenko and N. Mouadili and A. Moussa and I. Nikolic-Audit and C. C. Ohm and H. Okawa and S. Okkerman and M. Ouchrif and C. Pénélaud and A. Parreira and B. Pascual Dias and J. Pinol Bel and P. -O. Puhl and M. Puklavec and M. Qi and J. Qin and H. Ren and H. Riani and S. Ridaouni and V. Rogozin and L. Royer and F. Rudnyckyj and E. F. Saad and G. T. Saito and A. Salem and H. Santos and Ph. Schwemling and N. Seguin-Moreau and L. Serin and R. P. Serrano Fernandez and Q. Sha and A. Shaikovskii and L. Shan and R. Shen and X. Shi and P. Skomina and H. Smitmanns and H. L. Snoek and A. P. Soulier and A. Stein and H. Stenzel and J. Strandberg and W. Sun and X. Sun and Y. Sun and Y. Tan and K. Tariq and Y. Tayalati and S. Terzo and A. Torrento Coello and S. Trincaz-Duvoid and U. M. Vande Voorde and I. Velkovska and R. P. Vieira and L. A. Vieira Lopes and A. Visibile and J. Wan and W. Wang and C. Wang and Y. Wang and Y. Wang and A. Wang and T. Wang and T. Wang and S. M. Wang and Q. Weitzel and J. Wu and W. Wu and Y. Wu and M. Wu and L. Xia and H. Xu and D. Xu and L. Xu and Z. Yan and X. Yang and X. Yang and H. Yang and H. Yang and J. Ye and I. Youbi and J. Yuan and I. Zahir and H. Zeng and T. Zhang and J. Zhang and Z. Zhang and L. Zhang and D. Zhang and M. Zhao and Z. Zhao and X. Zheng and Z. Zhou and Y. Zhu and X. Zhuang},
journal= {arXiv preprint arXiv:2509.14045},
year = {2025}
}
Comments
15 pages, 12 figures, 7 tables