Related papers: Multi-Partner Project: COIN-3D -- Collaborative In…
To overcome the well-known memory bottleneck of AI chips, 3D stacked architectures that employ advanced packaging technology with high-density through-silicon vias (TSVs) pins have proven to be a promising solution. The 3D-stacked AI chip…
Computer simulations are becoming an essential tool in many scientific fields from molecular dynamics to aeronautics. In glaciology, future predictions of sea level change require input from ice sheet models. Due to uncertainties in the…
Sim-to-real transfer remains a significant challenge in soft robotics due to the unpredictability introduced by common manufacturing processes such as 3D printing and molding. These processes often result in deviations from simulated…
The EURETILE project required the selection and coding of a set of dedicated benchmarks. The project is about the software and hardware architecture of future many-tile distributed fault-tolerant systems. We focus on dynamic workloads…
Leveraging 2.5D interposer technology, we advocate the integration of untrusted commodity components/chiplets with physically separate, entrusted logic components. Such organization provides a modern root of trust for secure system-level…
In an era where scientific experiments can be very costly, multi-fidelity emulators provide a useful tool for cost-efficient predictive scientific computing. For scientific applications, the experimenter is often limited by a tight…
For the Inner Tracking System 3 (ITS3) upgrade, the ALICE experiment at CERN requires monolithic active pixel sensors of dimensions up to 97~mm$\,\times\,$266~mm, occupying a large fraction of a 300 mm wafer. To manufacture such a…
Photonics has been one of the primary beneficiaries of advanced silicon manufacturing. By leveraging on mature complementary metal-oxide-semiconductor (CMOS) process nodes, unprecedented device uniformities and scalability have been…
Reflective surfaces present a persistent challenge for reliable 3D mapping and perception in robotics and autonomous systems. However, existing reflection datasets and benchmarks remain limited to sparse 2D data. This paper introduces the…
Network testing plays an important role in the iterative process of developing new communication protocols and algorithms. However, test environments have to keep up with the evolution of technology and require continuous update and…
The safe operation of automated vehicles depends on their ability to perceive the environment comprehensively. However, occlusion, sensor range, and environmental factors limit their perception capabilities. To overcome these limitations,…
Accurate 3D reconstruction of objects with reflective, transparent, or low-texture surfaces still remains notoriously challenging. Such materials often violate key assumptions in multi-view reconstruction pipelines, such as photometric…
The rapid adoption of chiplet-based heterogeneous integration is reshaping semiconductor design by enabling modular, scalable, and faster time-to-market solutions for AI and high-performance computing. However, multi-vendor assembly in…
In the construction of High-Luminosity Large Hadron Collider (HL-LHC) and Future Circular Collider (FCC) experiments, 3D pixel sensors have become indispensable components due to their superior radiation hardness, fast response, and low…
We review threats and selected schemes concerning hardware security at design and manufacturing time as well as at runtime. We find that 3D integration can serve well to enhance the resilience of different hardware security schemes, but it…
The adoption of blockchain based distributed ledgers is growing fast due to their ability to provide reliability, integrity, and auditability without trusted entities. One of the key capabilities of these emerging platforms is the ability…
Semiconductor quantum dot spin qubits hold significant potential for scaling to millions of qubits for practical quantum computing applications, as their structure highly resembles the structure of conventional transistors. Since classical…
The field of 3D object detection from point clouds is rapidly advancing in computer vision, aiming to accurately and efficiently detect and localize objects in three-dimensional space. Current 3D detectors commonly fall short in terms of…
The edge computing paradigm has emerged to handle cloud computing issues such as scalability, security and low response time among others. This new computing trend heavily relies on ubiquitous embedded systems on the edge. Performance and…
Vertically integrated (3D) combinations of sensors and electronics provide the ability to fabricate small, fine pitch pixels with very small total capacitance monolithically integrated with complex circuitry. The small capacitance, enabled…