Related papers: Multi-Partner Project: COIN-3D -- Collaborative In…
Photonic integrated circuits utilize various waveguide materials, each excelling in specific metrics like efficient light emission, low propagation loss, high electro-optic efficiency, and potential for mass production. Inherent…
This paper outlines an FPGA VLSI design methodology that was used to realize a fully functioning FPGA chip in 130nm CMOS with improved routability and memory robustness. The architectural design space exploration and synthesis capability…
Modern large-scale scientific discovery requires multidisciplinary collaboration across diverse computing facilities, including High Performance Computing (HPC) machines and the Edge-to-Cloud continuum. Integrated data analysis plays a…
Collaborative perception plays a crucial role in enhancing environmental understanding by expanding the perceptual range and improving robustness against sensor failures, which primarily involves collaborative 3D detection and tracking…
The current trend for domain-specific architectures (DSAs) has led to renewed interest in research test chips to demonstrate new specialized hardware. Tape-outs also offer huge pedagogical value garnered from real hands-on exposure to the…
Future complementary metal oxide semiconductor (CMOS) scaling for advanced integrated circuit (IC) technologies may well depend on "More than Moore" (MtM) approaches using heterogeneous integration of semiconductor-based devices. In order…
With the rise of Deep Learning (DL), our world braces for AI in every edge device, creating an urgent need for edge-AI SoCs. This SoC hardware needs to support high throughput, reliable and secure AI processing at Ultra Low Power (ULP),…
As the demand for high-speed and low-power electronics continues to grow, the quasi-delay-insensitive (QDI) asynchronous domain of digital design has emerged as a promising alternative to traditional clock-based designs. However, the…
Differentiable simulation of soft bodies is a foundation for system identification, trajectory optimization, and Real2Sim transfer. Yet, existing methods such as the differentiable Projective Dynamics (DiffPD) struggle when faced with…
As Very Large Scale Integration (VLSI) designs continue to scale in size and complexity, layout verification has become a central challenge in modern Electronic Design Automation (EDA) workflows. In practice, congestion can only be…
Performance increase with general-purpose processors has come to a halt. We can no longer depend on Moore's Law to increase computing performance. The only way to achieve higher performance or lower energy consumption is by building…
Integrated circuits and electronic systems, as well as design technologies, are evolving at a great rate -- both quantitatively and qualitatively. Major developments include new interconnects and switching devices with atomic-scale…
The physics aims at the proposed high-energy $e^+e^-$ collider CLIC pose challenging demands on the performance of the detector system. Precise hit-time tagging, an excellent spatial resolutions, and a low mass are required for the vertex…
The unabated growth in AI workload demands is driving the need for concerted advances in compute, memory, and interconnect performance. As traditional semiconductor scaling slows, high-speed interconnects have emerged as the new scaling…
Fan-out wafer-level packaging (FOWLP) addresses the demand for higher interconnect densities by offering reduced form factor, improved signal integrity, and enhanced performance. However, FOWLP faces manufacturing challenges such as…
Blockchains offer a decentralized and secure execution environment strong enough to host cryptocurrencies, but the state-replication model makes on-chain computation expensive. To avoid heavy on-chain workloads, systems like Truebit and…
Performance optimization associated with optical modulators requires reasonably accurate predictive models for key figures of merit. Interleaved PN-junction topology offers the maximum mode/junction overlap and is the most efficient…
The future of computing systems is inevitably embracing a disaggregated and composable pattern: from clusters of computers to pools of resources that can be dynamically combined together and tailored around applications requirements.…
With the promise of reliability in cloud, more enterprises are migrating to cloud. The process of continuous integration/deployment (CICD) in cloud connects developers who need to deliver value faster and more transparently with site…
We present LATTICE, a new framework for high-fidelity 3D asset generation that bridges the quality and scalability gap between 3D and 2D generative models. While 2D image synthesis benefits from fixed spatial grids and well-established…