Related papers: Multi-Partner Project: COIN-3D -- Collaborative In…
Thermally aware design of 2.5D and 3D advanced packaging systems will require fast, accurate, and powerful thermal analysis of chiplets, stacks, and packages. These systems contain multiple materials with non-linear heat transfer properties…
Hybrid systems comprising superconducting and semiconducting materials are promising architectures for quantum computing. Superconductors induce long-range interactions between the spin degrees of freedom of semiconducting quantum dots.…
A long-standing challenge is the design of chips resilient to faults and glitches. Both fine-grained gate diversity and coarse-grained modular redundancy have been used in the past. However, these approaches have not been well-studied under…
Design under uncertainty is a challenging problem, as a systems performance can be highly sensitive to variations in input parameters and model uncertainty. A conventional approach to addressing such problems is robust optimization, which…
Recent advances in 3D point cloud transformers have led to state-of-the-art results in tasks such as semantic segmentation and reconstruction. However, these models typically rely on dense token representations, incurring high computational…
Heterogeneous manycore architectures are the key to efficiently execute compute- and data-intensive applications. Through silicon via (TSV)-based 3D manycore system is a promising solution in this direction as it enables integration of…
Three-dimensional (3D) photonic integrated circuits (PIC) are emerging as an indispensable scheme for high density and multifunctional photonic systems. However, the wafer-scale scaling of PICs towards a 3D configuration is constrained by…
Self-assembly of complex and functional materials remains a grand challenge in soft material science. Efficient assembly depends on a delicate balance between thermodynamic and kinetic effects, requiring fine-tuning affinities and…
Multi-modal 3D object detection models for automated driving have demonstrated exceptional performance on computer vision benchmarks like nuScenes. However, their reliance on densely sampled LiDAR point clouds and meticulously calibrated…
Utilizing the latest advances in Artificial Intelligence (AI), the computer vision community is now witnessing an unprecedented evolution in all kinds of perception tasks, particularly in object detection. Based on multiple spatially…
3D integration offers key advantages in improving system performance and efficiency for the End-of-Scaling era. It enables the incorporation of heterogeneous system components and disparate technologies, eliminates off-chip communication…
Three-Dimensional Networks-on-Chips (3D-NoCs) have been proposed as an auspicious solution, merging the high parallelism of the Network-on-Chip (NoC) paradigm with the high-performance and low-power cost of 3D-ICs. However, as technology…
The semiconductor industry's rapid advancement pushes conventional two-dimensional technology to its utmost limitations in terms of scaling, performance, and cost factors. These challenges drive the usage of 3D technology in the production…
The open and cooperative nature of Cyber-Physical Systems (CPS) poses new challenges in assuring dependability. The DEIS project (Dependability Engineering Innovation for automotive CPS. This project has received funding from the European…
The past few years have witnessed vibrant efforts in discovering new two-dimensional (2D) semiconductor materials from both academia and the industry, due to their promising potential in resolving the severe performance deterioration of…
Modern integrated circuits are essentially two-dimensional (2D). Partial three-dimensional (3D) integration and 3D-transistor-level integrated circuits have long been anticipated as routes to improve the performance, cost and size of…
High-fidelity electron microscopy simulations required for quantitative crystal structure refinements face a fundamental challenge: while physical interactions are well-described theoretically, real-world experimental effects are…
Conventional 2D CMOS technology is reaching fundamental scaling limits, and interconnect bottleneck is dominating integrated circuit (IC) power and performance. While 3D IC technologies using Through Silicon Via or Monolithic Inter-layer…
Chiplet architectures are on the rise as they promise to overcome the scaling challenges of monolithic chips. A key component of such architectures is an efficient inter-chiplet interconnect (ICI). The ICI design space is huge as there are…
The chiplet-based System-in-Package~(SiP) technology enables more design flexibility via various inter-chiplet connection and heterogeneous integration. However, it is not known how to convert such flexibility into cost efficiency, which is…