Related papers: Multi-Partner Project: COIN-3D -- Collaborative In…
Reliability has emerged as a key topic of interest for researchers around the world to detect and/or mitigate the side effects of decreasing transistor sizes, such as soft errors. Traditional solutions, like DMR and TMR, incur significant…
This paper considers the use of novel technologies for mitigating attacks that aim at compromising intrusion detection systems (IDSs). Solutions based on collaborative intrusion detection networks (CIDNs) could increase the resilience…
Parallel and monolithic 3D integration directions offer pathways to realize 3D integrated circuits (ICs) but still lead to layer-by-layer implementations, each functional layer being composed in 2D first. This mindset causes challenging…
Future high-luminosity hadron collider experiments feature unprecedented levels of event pile-up and extreme radiation environments, calling for sensors capable of 4D tracking, even after significant radiation damage. To this purpose, 3D…
On the advent of the slow death of Moore's law, the silicon industry is moving towards a new era of chiplets. The automotive industry is experiencing a profound transformation towards software-defined vehicles, fueled by the surging demand…
Edge computing draws a lot of recent research interests because of the performance improvement by offloading many workloads from the remote data center to nearby edge nodes. Nonetheless, one open challenge of this emerging paradigm lies in…
3D die stacking and 2.5D interposer design are promising technologies to improve integration density, performance and cost. Current approaches face serious issues in dealing with emerging security challenges such as side channel attacks,…
As spatial and temporal resolutions of scientific instruments improve, the explosion in the volume of data produced is becoming a key challenge. It can be a critical bottleneck for integration between scientific instruments at the edge and…
We introduce Torch-Points3D, an open-source framework designed to facilitate the use of deep networks on3D data. Its modular design, efficient implementation, and user-friendly interfaces make it a relevant tool for research and…
Hybrid systems with both discrete and continuous dynamics are an important model for real-world cyber-physical systems. The key challenge is to ensure their correct functioning w.r.t. safety requirements. Promising techniques to ensure…
The proliferation of large language models (LLMs) is accelerating the integration of multimodal assistants into edge devices, where inference is executed under stringent latency and energy constraints, often exacerbated by intermittent…
The emergence of chiplet-based heterogeneous integration is transforming the semiconductor, AI, and high-performance computing industries by enabling modular designs and improved scalability. However, assembling chiplets from multiple…
The Framework is one of the subprojects of the Joint COntrols Project (JCOP), which is collaboration between the four LHC experiments and CERN. By sharing development, this will reduce the overall effort required to build and maintain the…
Recently, hardware technology has rapidly evolved pertaining to domain-specific applications/architectures. Soon, processors may be composed of a large collection of vendor-independent IP specialized for application-specific algorithms,…
With transistor scaling reaching its limits, interposer-based integration of dies (chiplets) is gaining traction. Such an interposer-based integration enables finer and tighter interconnect pitch than traditional system-on-packages and…
The increasing power densities and intricate heat dissipation paths in advanced 2.5D/3D chiplet systems necessitate thermal modeling frameworks that deliver detailed thermal maps with high computational efficiency. Traditional compact…
Hybrid circuit quantum electrodynamics (cQED) aims at coupling various quantum degrees of freedom, among which are spin and charge degrees of freedom in gate defined quantum dots, phonons or magnons... with quantized electromagnetic fields…
Advanced packaging and chiplet-based integration are increasingly adopted to build complex heterogeneous systems beyond the limits of monolithic scaling. While these architectures offer major benefits in terms of modularity, yield, and…
The multi-line LiDAR is widely used in autonomous vehicles, so point cloud-based 3D detectors are essential for autonomous driving. Extracting rich multi-scale features is crucial for point cloud-based 3D detectors in autonomous driving due…
Multi-chip integration is widely recognized as the extension of Moore's Law. Cost-saving is a frequently mentioned advantage, but previous works rarely present quantitative demonstrations on the cost superiority of multi-chip integration…