Related papers: STAMP-2.5D: Structural and Thermal Aware Methodolo…
Microfluidic cooling has been recognized as one of the most promising solutions to achieve efficient thermal management for three-dimensional integrated circuits (3DICs). It enables more opportunities to architect 3DICs with different die…
Stripe patterns are ubiquitous in nature and everyday life. While the synthesis of these patterns has been thoroughly studied in the literature, their potential to control the mechanics of structured materials remains largely unexplored. In…
Topologically interlocking architectures can generate tough ceramics with attractive thermo-mechanical properties. This concept can make the material design pathway a challenging task, since modeling the whole design space is neither…
There is a growing call for greater amounts of increasingly agile computational power for edge and cloud infrastructure to serve the computationally complex needs of ubiquitous computing devices. Thus, an important challenge is addressing…
As integrated circuits continue to scale down and adopt three-dimensional (3D) stacking, thermal management in the back-end-of-line (BEOL) has emerged as a critical design constraint. In this study, we present a combined experimental and…
This study proposes a high-order multi-scale method tailored for time-dependent nonlinear thermo-electro-mechanical coupling problems of composite structures with highly spatial heterogeneity, which incorporate temperature-dependent…
Catastrophic failure in brittle materials is often due to the rapid growth and coalescence of cracks aided by high internal stresses. Hence, accurate prediction of maximum internal stress is critical to predicting time to failure and…
A thermodynamic framework has been developed for a class of amorphous polymers used in fused deposition modeling (FDM), in order to predict the residual stresses and the accompanying distortion of the geometry of the printed part (warping).…
The adoption of machine learning-based techniques for analog integrated circuit layout, unlike its digital counterpart, has been limited by the stringent requirements imposed by electric and problem-specific constraints, along with the…
A finite-element method dependant adjoint-based procedure to determine the temperature field of structures based on measured displacements or strains and a set of standard loads is developed and tested. Given a series of force and…
Most previous 3D IC research focused on stacking traditional 2D silicon layers, so the interconnect reduction is limited to inter-block delays. In this paper, we propose techniques that enable efficient exploration of the 3D design space…
Decoupling approach presents a novel solution/alternative to the highly time-consuming fluid-thermal-structural simulation procedures when thermal effects and resultant displacements on machine tools are analyzed. Using high dimensional…
In the post-Moore era, 2.5D chiplet-based ICs present significant challenges in thermal management due to increased power density and thermal hotspots. Neural network-based thermal prediction models can perform real-time predictions for…
Future complementary metal oxide semiconductor (CMOS) scaling for advanced integrated circuit (IC) technologies may well depend on "More than Moore" (MtM) approaches using heterogeneous integration of semiconductor-based devices. In order…
In this paper, we propose StruM, a novel structured mixed-precision-based deep learning inference method, co-designed with its associated hardware accelerator (DPU), to address the escalating computational and memory demands of deep…
Engineering structures must often be designed to resist thermally induced stresses. Significant progress has been made on the design of such structures through thermo-elastic topology optimization. However, a computationally efficient…
Thermodynamic and flash equilibrium calculations are the cornerstones of simulation process calculations. The iterative approach, a widely used nonlinear problem-solving technique, relies on derivative calculations throughout the procedure…
As semiconductor manufacturing advances from the 3-nm process toward the sub-nanometer regime and transitions from FinFETs to gate-all-around field-effect transistors (GAAFETs), the resulting complexity and manufacturing challenges continue…
This paper concerns the self-assembly of scaled-up versions of arbitrary finite shapes. We work in the multiple temperature model that was introduced by Aggarwal, Cheng, Goldwasser, Kao, and Schweller (Complexities for Generalized Models of…
Additive manufacturing (AM) techniques hold promise but face significant challenges in process planning and optimization. The large temporal and spatial variations in temperature that can occur in layer-wise AM lead to thermal excursions,…