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The simulation of heat flow through heterogeneous material is important for the design of structural and electronic components. Classical analytical solutions to the heat equation PDE are not known for many such domains, even those having…

Numerical Analysis · Mathematics 2019-05-21 Andrew Loeb , Christopher Earls

In this laboratory-based study, a plate was designed, manufactured and then characterised thermally and dimensionally using a thermal imager. This plate comprised a range of known scratch, dent, thinning and pitting artefacts as mimics of…

Topology optimization (TO) in two dimensions often presents a trade-off between structural performance and manufacturability, with unpenalized (variable-thickness) methods yielding superior but complex designs, and penalized (SIMP) methods…

Computational Engineering, Finance, and Science · Computer Science 2025-07-28 Gabriel Stankiewicz , Chaitanya Dev , Paul Steinmann

On the advent of the slow death of Moore's law, the silicon industry is moving towards a new era of chiplets. The automotive industry is experiencing a profound transformation towards software-defined vehicles, fueled by the surging demand…

Trapped ions are among the most promising platforms for realizing a large-scale quantum information processor. Current progress focuses on integrating optical and electronic components into microfabricated ion traps to allow scaling to…

By combining Three Dimensional Integrated Circuits with the Network-on-Chip infrastructure to obtain 3D Networks-on-Chip (3D-NoCs), the new on-chip communication paradigm brings several advantages on lower power, smaller footprint and lower…

Hardware Architecture · Computer Science 2020-03-20 Khanh N. Dang , Akram Ben Ahmed , Abderazek Ben Abdallah , Xuan-Tu Tran

In this paper a phase-field approach for structural topology optimization for a 3D-printing process which includes stress constraint and potentially multiple materials or multiscales is analyzed. First order necessary optimality conditions…

Optimization and Control · Mathematics 2019-07-16 Ferdinando Auricchio , Elena Bonetti , Massimo Carraturo , Dietmar Hömberg , Alessandro Reali , Elisabetta Rocca

A cost-effective and robust image-processing pipeline is presented for the detection and characterization of exfoliated two-dimensional (2D) material flakes in optical microscope images, designed to facilitate automation in van der Waals…

Mesoscale and Nanoscale Physics · Physics 2025-09-03 Yutao Li , Logan Sherlock , Ryan Benderson , Daniel Ostrom , Huandong Chen , Kazuhiro Fujita , Abhay Pasupathy

In recent years, the embedding approach for solving switched optimal control problems has been developed in a series of papers. However, the embedding approach, which advantageously converts the hybrid optimal control problem to a classical…

Optimization and Control · Mathematics 2018-04-04 Richard Meyer , Miloš Žefran , Raymond A. DeCarlo

The goals of reducing energy costs, shifting electricity peaks, increasing the use of renewable energy, and enhancing the stability of the electric grid can be met in part by fully exploiting the energy flexibility potential of buildings…

Strain engineering is an effective tool for tailoring the properties of two-dimensional (2D) materials, especially for tuning quantum phenomena. Among the limited methods available for strain engineering under cryogenic conditions, thermal…

Gradient porous structured materials possess significant potential of being applied in many engineering fields. To accelerate the design process of infill graded microstructures, a novel asymptotic homogenisation topology optimisation…

Computational Engineering, Finance, and Science · Computer Science 2019-12-18 Dingchuan Xue , Yichao Zhu , Shaoshuai Li , Chang Liu , Weisheng Zhang , Xu Guo

This study presents a finite element and virtual element (FE-VE) coupled method for thermomechanical analysis in electronic packaging structures. The approach partitions computational domains strategically, employing FEM for regular…

Numerical Analysis · Mathematics 2026-01-14 Yanpeng Gong , Sishuai Li , Yue Mei , Bingbing Xu , Fei Qin , Xiaoying Zhuang , Timon Rabczuk

We propose the realization of capacitive temperature sensors based on the concept of displacement amplification. Our design features two high coefficient of thermal expansion (CTE) metallic layers separated by a low-CTE dielectric layer;…

Applied Physics · Physics 2022-03-31 Semih Taniker , Vincenzo Costanza , Paolo Celli , Chiara Daraio

To effectively assess structural damage, it is essential to localize the instances of damage in the physical world of a civil structure. ENSTRECT is a stage-based approach designed to accomplish 2.5D structural damage detection. The method…

Computer Vision and Pattern Recognition · Computer Science 2024-10-04 Christian Benz , Volker Rodehorst

The escalating adoption of diffusion models for applications such as image generation demands efficient parallel inference techniques to manage their substantial computational cost. However, existing diffusion parallelism inference schemes…

Distributed, Parallel, and Cluster Computing · Computer Science 2025-09-16 Han Liang , Jiahui Zhou , Zicheng Zhou , Xiaoxi Zhang , Xu Chen

In recent years, floor plan segmentation has gained significant attention due to its wide range of applications in floor plan reconstruction and robotics. In this paper, we propose a novel 2D floor plan segmentation technique based on a…

Computer Vision and Pattern Recognition · Computer Science 2023-03-27 Mohammadreza Sharif , Kiran Mohan , Sarath Suvarna

Reconstructing a thermal model capable of efficiently simulating the behavior of a spacecraft from sparse and localized temperature measurements remains a challenging task. To address this, we introduce a physically-constrained calibration…

Numerical Analysis · Mathematics 2026-05-28 Luca Sosta , Carlo Ciancarelli , Leonardo Marini , Stefano Pagani , Francesco Regazzoni , Nicola Parolini

In this paper, we propose and study the effectiveness of customer engagement plans that clearly specify the amount of intervention in customer's load settings by the grid operator for peak load reduction. We suggest two different types of…

Systems and Control · Computer Science 2015-02-16 Naveed Ul Hassan , Yawar Ismail Khalid , Chau Yuen , Wayes Tushar

Modern machine learning (ML) applications are becoming increasingly complex and monolithic (single chip) accelerator architectures cannot keep up with their energy efficiency and throughput demands. Even though modern digital electronic…

Hardware Architecture · Computer Science 2024-03-08 Febin Sunny , Ebadollah Taheri , Mahdi Nikdast , Sudeep Pasricha
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