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Generative Recommendation (GR) has recently transitioned from atomic item-indexing to Semantic ID (SID)-based frameworks to capture intrinsic item relationships and enhance generalization. However, the adoption of high-granularity SIDs…
This paper presents an innovative Transformer-based deep learning strategy for optimizing the placement of sensors aiming at structural health monitoring of semiconductor probe cards. Failures in probe cards, including substrate cracks and…
A persistent challenge with the development of electric vertical take-off and landing vehicles (eVTOL) to meet flight power and energy demands is the mass of the load and thermal management systems for batteries. One possible strategy to…
The computing industry is forced to find alternative design approaches and computing platforms to sustain increased power efficiency, while providing sufficient performance. Among the examined solutions, Approximate Computing, Hardware…
At elevated temperature environments, elastic structures experience a change of the stress-free state of the body that can strongly influence the optimal topology of the structure. This work presents level-set based topology optimization of…
The emergence of chiplet-based heterogeneous integration is transforming the semiconductor, AI, and high-performance computing industries by enabling modular designs and improved scalability. However, assembling chiplets from multiple…
To overcome the well-known memory bottleneck of AI chips, 3D stacked architectures that employ advanced packaging technology with high-density through-silicon vias (TSVs) pins have proven to be a promising solution. The 3D-stacked AI chip…
The athermal quasistatic deformation method provides an elegant solution to overcome the limitation of short time spans in molecular simulations. It provides overdamped conditions, allowing for the extraction of purely structural responses…
Multi-Processor Systems-on-Chip (MPSoC) can deliver high performance needed in many industrial domains, including aerospace. However, their high power consumption, combined with avionics safety standards, brings new thermal management…
The thermophysical properties of supported and free-standing nanomaterials would be different due to the substrate effect. To determine the thermophysical properties of supported 2D nanomaterials, this paper developed a two-step…
Analyzing data centers with thermal-aware optimization techniques is a viable approach to reduce energy consumption of data centers. By taking into account thermal consequences of job placements among the servers of a data center, it is…
The reported research work presents numerical studies validated by experimental results of a flat micro heat pipe with sintered copper wick structure. The objectives of this project are to produce and demonstrate the efficiency of the…
Electromigration (EM) is one of the major concerns in the reliability analysis of very large scale integration (VLSI) systems due to the continuous technology scaling. Accurately predicting the time-to-failure of integrated circuits (IC)…
Thermal analysis is crucial in 3D-IC design due to increased power density and complex heat dissipation paths. Although operator learning frameworks such as DeepOHeat~\cite{liu2023deepoheat} have demonstrated promising preliminary results…
Driven by a need for ever increasing chip performance and inclusion of innovative features, a growing number of semiconductor companies are opting for all-inclusive System-on-Chip (SoC) architectures. Although Moore's Law has been able to…
This work introduces an ensemble parameter estimation framework that enables the Lumped Parameter Linear Superposition (LPLSP) method to generate reduced order thermal models from a single transient dataset. Unlike earlier implementations…
Current approaches to scheduling workloads on heterogeneous systems with specialized accelerators often rely on manual partitioning, offloading tasks with specific compute patterns to accelerators. This method requires extensive…
Self-assembly is one of the prevalent strategies used by living systems to fabricate ensembles of precision nanometer-scale structures and devices. The push for analogous approaches to create synthetic nanomaterials has led to the…
Thermal dynamics modeling has been a critical issue in building heating, ventilation, and air-conditioning (HVAC) systems, which can significantly affect the control and maintenance strategies. Due to the uniqueness of each specific…
The high dissipation of integrated circuits means serious problems for packaging and for the design of complex electronic systems. Another important area of research and development nowadays is the integration of sensors and micromechanical…