Related papers: STAMP-2.5D: Structural and Thermal Aware Methodolo…
The 2-D discrete wavelet transform (DWT) can be found in the heart of many image-processing algorithms. Until recently, several studies have compared the performance of such transform on various shared-memory parallel architectures,…
Utilizing patch-based transformers for unstructured geometric data such as polygon meshes presents significant challenges, primarily due to the absence of a canonical ordering and variations in input sizes. Prior approaches to handling 3D…
The current state of the art of Simultaneous Localisation and Mapping, or SLAM, on low power embedded systems is about sparse localisation and mapping with low resolution results in the name of efficiency. Meanwhile, research in this field…
Real-time embedded platforms with resource constraints can take the benefits of mixed-criticality system where applications with different criticality-level share computational resources, with isolation in the temporal and spatial domain. A…
Planning for sequential robotics tasks often requires integrated symbolic and geometric reasoning. TAMP algorithms typically solve these problems by performing a tree search over high-level task sequences while checking for kinematic and…
It is a challenging task to train large DNN models on sophisticated GPU platforms with diversified interconnect capabilities. Recently, pipelined training has been proposed as an effective approach for improving device utilization. However,…
Modular trapped-ion (TI) architectures offer a scalable quantum computing (QC) platform, with native transport behaviors that closely resemble the Single Instruction Multiple Data (SIMD) paradigm. We present FluxTrap, a SIMD-aware compiler…
Interconnect is one of the main performance determinant of modern integrated circuits (ICs). The new technology of vertical ICs places circuit blocks in the vertical dimension in addition to the conventional horizontal plane. Compared to…
The management of the energy consumption and thermal dissipation of multi-core heterogeneous platforms is becoming increasingly important as it can have direct impact on the platform performance. This paper discusses an approach that…
Stencil computation is one of the most widely-used compute patterns in high performance computing applications. Spatial and temporal blocking have been proposed to overcome the memory-bound nature of this type of computation by moving…
In recent years, the growing demand to process large graphs and sparse datasets has led to increased research efforts to develop hardware- and software-based architectural solutions to accelerate them. While some of these approaches achieve…
Technological advances are in part enabled by the development of novel manufacturing processes that give rise to new materials or material property improvements. Development and evaluation of new manufacturing methodologies is labor-,…
Monolithic 3D (M3D) technology enables high density integration, performance, and energy-efficiency by sequentially stacking tiers on top of each other. M3D-based network-on-chip (NoC) architectures can exploit these benefits by adopting…
3D-stacked High Bandwidth Memory (HBM) architectures provide high-performance memory interactions to address the well-known performance challenge, namely the memory wall. However, these architectures are susceptible to thermal…
We present an accelerated algorithm that samples correctly the thermodynamic ensemble in complex systems where the dynamics is controlled by activation barriers. The efficiency of the thermodynamically-weighted activation-relaxation…
Accelerated cooling is a key technology in producing thermomechanically controlled processed (TMCP) steel plates. In a TMCP process hot plates are subjected to a strong cooling what results in a complex microstructure leading to increased…
Due to reduced manufacturing yields, traditional monolithic chips cannot keep up with the compute, memory, and communication demands of data-intensive applications, such as rapidly growing deep neural network (DNN) models. Chiplet-based…
Thermal aware routing and placement algorithms are important in industry. Currently, there are reasonably fast Green's function based algorithms that calculate the temperature distribution in a chip made from a stack of different materials.…
This work develops a polygonal finite element method (PFEM) for the analysis of steady-state and transient thermal stresses in two dimensional continua. The method employs Wachspress rational basis functions to construct conforming…
In computational engineering, ensuring the integrity and safety of structures in fields such as aerospace and civil engineering relies on accurate stress prediction. However, analytical methods are limited to simple test cases, and…