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The proliferation of heterogeneous chip multiprocessors in recent years has reached unprecedented levels. Traditional homogeneous platforms have shown fundamental limitations when it comes to enabling high-performance yet-ultra-low-power…
The rapid adoption of chiplet-based heterogeneous integration is reshaping semiconductor design by enabling modular, scalable, and faster time-to-market solutions for AI and high-performance computing. However, multi-vendor assembly in…
Thermal management is a major challenge in next-generation high-performance computing systems, particularly for heterogeneous multi-chip packages such as the NVIDIA GB200 Grace Blackwell Superchip. In this work, a physics-based…
Gradient-based algorithms are crucial to modern computer-vision and graphics applications, enabling learning-based optimization and inverse problems. For example, photorealistic differentiable rendering pipelines for color images have been…
This paper focuses on the simulation of multi-die System-on-Chip (SoC) architectures using VisualSim, emphasizing chiplet-based system modeling and performance analysis. Chiplet technology presents a promising alternative to traditional…
This paper addresses the challenges of thermal sensor allocation and full-chip temperature reconstruction in multi-core systems by leveraging an entropy-based sensor placement strategy and an adaptive compressive sensing approach. By…
In this paper we demonstrate the power of a model of tile self-assembly based on active glues which can dynamically change state. We formulate the Signal-passing Tile Assembly Model (STAM), based on the model of Padilla, Liu, and Seeman to…
Thermal management is an important challenge in modern electronics, avionics, automotive, and energy storage systems. While passive thermal solutions (like heat sinks or heat spreaders) are often used, actively modulating heat flow (e.g.…
Analog integrated circuit (IC) floorplanning is typically a manual process with the placement of components (devices and modules) planned by a layout engineer. This process is further complicated by the interdependence of floorplanning and…
Advanced packaging offers a new design paradigm in the post-Moore era, where many small chiplets can be assembled into a large system. Based on heterogeneous integration, a chiplet-based accelerator can be highly specialized for a specific…
Fan-out wafer-level packaging (FOWLP) addresses the demand for higher interconnect densities by offering reduced form factor, improved signal integrity, and enhanced performance. However, FOWLP faces manufacturing challenges such as…
The 2-Handed Assembly Model (2HAM) is a tile-based self-assembly model in which, typically beginning from single tiles, arbitrarily large aggregations of static tiles combine in pairs to form structures. The Signal-passing Tile Assembly…
Shape memory structures are playing an important role in many cutting-edge intelligent fields. However, the existing technologies can only realize 4D printing of a single polymer or metal, which limits practical applications. Here, we…
A key challenge in fast ground robot navigation in 3D terrain is balancing robot speed and safety. Recent work has shown that 2.5D maps (2D representations with additional 3D information) are ideal for real-time safe and fast planning.…
Recent embedded systems are designed with high-performance System-on-Chips (SoCs) to satisfy the computational needs of complex applications widely used in real life, such as airplane controllers, autonomous driving automobiles, medical…
Large language model (LLM) decoding is a major inference bottleneck because its low arithmetic intensity makes performance highly sensitive to memory bandwidth. 3D-stacked near-memory processing (NMP) provides substantially higher local…
The latest sheet stamping processes enable efficient manufacturing of complex shape structural components that have high stiffness to weight ratios, but these processes can introduce defects. To assist component design for stamping…
A support structure is required to successfully create structural parts in the powder bed fusion process for additive manufacturing. In this study, we present the topology optimization of a support structure that improves the heat…
This work presents a diffusion transformer framework for data-driven structural topology optimization that combines the accuracy of physics-based methods with the efficiency of generative deep learning. Conventional approaches such as the…
Thermal energy storage using sensible heating of a solid storage medium is a potential low-cost technology for long-duration energy storage. To effectively get heat in and out of the solid material, channels of heat transfer fluid can be…