Related papers: HeM3D: Heterogeneous Manycore Architecture Based o…
3D-stacked High Bandwidth Memory (HBM) architectures provide high-performance memory interactions to address the well-known performance challenge, namely the memory wall. However, these architectures are susceptible to thermal…
As modern electronic devices are increasingly miniaturized and integrated, their performance relies more heavily on effective thermal management. Two-phase cooling methods enhanced by porous surfaces, which capitalize on thin-film…
A three-dimensional (3D) Network-on-Chip (NoC) enables the design of high performance and low power many-core chips. Existing 3D NoCs are inadequate for meeting the ever-increasing performance requirements of many-core processors since they…
Rapidly evolving artificial intelligence and machine learning applications require ever-increasing computational capabilities, while monolithic 2D design technologies approach their limits. Heterogeneous integration of smaller chiplets…
Increasing circuit complexity within quantum systems based on superconducting qubits necessitates high connectivity while retaining qubit coherence. Classical micro-electronic systems have addressed interconnect density challenges by using…
Mapping and 3D detection are two major issues in vision-based robotics, and self-driving. While previous works only focus on each task separately, we present an innovative and efficient multi-task deep learning framework (SM3D) for…
The marriage between a two-dimensional layered material (2DLM) and a complex transition metal oxide (TMO) results in a variety of physical and chemical phenomena that would not have been achieved in either material alone. Interesting recent…
Hybrid transceiver can strike a balance between complexity and performance of multiple-input multiple-output (MIMO) systems. In this paper, we develop a unified framework on hybrid MIMO transceiver design using matrix-monotonic…
Computation intensive kernels, such as convolutions, matrix multiplication and Fourier transform, are fundamental to edge-computing AI, signal processing and cryptographic applications. Interleaved-Multi-Threading (IMT) processor cores are…
The present Multi-view stereo (MVS) methods with supervised learning-based networks have an impressive performance comparing with traditional MVS methods. However, the ground-truth depth maps for training are hard to be obtained and are…
Multiscale topology optimization is crucial for designing porous infill structures with high stiffness-to-weight ratios and excellent energy absorption. Although gradient-based methods provide a rigorous framework, they are computationally…
Depth coding in 3D-HEVC for the multiview video plus depth (MVD) architecture (i) deforms object shapes due to block-level edge-approximation; (ii) misses an opportunity for high compressibility at near-lossless quality by failing to…
Energy-efficiency has become a major challenge in modern computer systems. To address this challenge, candidate systems increasingly integrate heterogeneous cores in order to satisfy diverse computation requirements by selecting cores with…
To cope with the soft errors and make full use of the multi-core system, this paper gives an efficient fault-tolerant hardware and software co-designed architecture for multi-core systems. And with a not large number of test patterns, it…
To date, Versatile Video Coding (VVC) has a more magnificent overall performance than High Efficiency Video Coding (HEVC). The Quadtree with Nested Multi-Type Tree (QTMT) coding block structure can substantially enhance video coding quality…
Materials designed by nature commonly exhibit functional grading and laminated structures, particularly when intended for enhanced impact protection. Synthetic materials have also found success in exploiting this concept with fully dense…
We present MVLayoutNet, an end-to-end network for holistic 3D reconstruction from multi-view panoramas. Our core contribution is to seamlessly combine learned monocular layout estimation and multi-view stereo (MVS) for accurate layout…
On-chip optical interconnect has been widely accepted as a promising technology to realize future large-scale multiprocessors. Mode-division multiplexing (MDM) provides a new degree of freedom for optical interconnects to dramatically…
Inverse design of high-resolution and fine-detailed 3D lightweight mechanical structures is notoriously expensive due to the need for vast computational resources and the use of very fine-scaled complex meshes. Furthermore, in designing for…
The present Multi-view stereo (MVS) methods with supervised learning-based networks have an impressive performance comparing with traditional MVS methods. However, the ground-truth depth maps for training are hard to be obtained and are…