Related papers: HeM3D: Heterogeneous Manycore Architecture Based o…
3D detailed radiative transfer is computationally taxing, since the solution of the radiative transfer equation involves traversing the six dimensional phase space of the 3D domain. With modern supercomputers the hardware available for…
3D understanding has drawn significant attention recently, leveraging Vision-Language Models (VLMs) to enable multi-modal reasoning between point cloud and text data. Current 3D-VLMs directly embed the 3D point clouds into 3D tokens,…
Dynamically adaptive multi-core architectures have been proposed as an effective solution to optimize performance for peak power constrained processors. In processors, the micro-architectural parameters or voltage/frequency of each core to…
The semiconductor industry is reaching a fascinating confluence in several evolutionary trends that will likely lead to a number of revolutionary changes in the design, implementation, scaling, and the use of computer systems. However,…
3D die stacking and 2.5D interposer design are promising technologies to improve integration density, performance and cost. Current approaches face serious issues in dealing with emerging security challenges such as side channel attacks,…
Millimeter-wave (mmWave) communication operated in frequency bands between 30 and 300 GHz has attracted extensive attention due to the potential ability of offering orders of magnitude greater bandwidths combined with further gains via…
Real-time systems, particularly those used in domains like automated driving, are increasingly adopting neural networks. From this trend arises the need for high-performance hardware exhibiting predictable timing behavior. While…
Matrix-multiplication units (MXUs) are now prevalent in every computing platform. The key attribute that makes MXUs so successful is the semiring structure, which allows tiling for both parallelism and data reuse. Nonetheless,…
In order to plan rapid response during disasters, first responder agencies often adopt `bring your own device' (BYOD) model with inexpensive mobile edge devices (e.g., drones, robots, tablets) for complex video analytics applications, e.g.,…
Since the introduction of massive MIMO (mMIMO), the design of a transceiver with feasible complexity has been a challenging problem. Initially, it was believed that the main issue in this respect is the overall RF-cost. However, as mMIMO is…
Heterogeneous systems-on-chip (SoCs) are highly favorable computing platforms due to their superior performance and energy efficiency potential compared to homogeneous architectures. They can be further tailored to a specific domain of…
Efficient and accurate 3D reconstruction is crucial for various applications, including augmented and virtual reality, medical imaging, and cinematic special effects. While traditional Multi-View Stereo (MVS) systems have been fundamental…
The NIR-to-RGB spectral domain translation is a formidable task due to the inherent spectral mapping ambiguities within NIR inputs and RGB outputs. Thus, existing methods fail to reconcile the tension between maintaining texture detail…
As one of the automotive sensors that have emerged in recent years, 4D millimeter-wave radar has a higher resolution than conventional 3D radar and provides precise elevation measurements. But its point clouds are still sparse and noisy,…
The reported research work presents numerical studies validated by experimental results of a flat micro heat pipe with sintered copper wick structure. The objectives of this project are to produce and demonstrate the efficiency of the…
Systolic arrays are popular for executing deep neural networks (DNNs) at the edge. Low latency and energy efficiency are key requirements in edge devices such as drones and autonomous vehicles. Monolithic 3D (MONO3D) is an emerging 3D…
Photonics has been one of the primary beneficiaries of advanced silicon manufacturing. By leveraging on mature complementary metal-oxide-semiconductor (CMOS) process nodes, unprecedented device uniformities and scalability have been…
Matrix-accelerated stencil computation is a hot research topic, yet its application to three-dimensional (3D) high-order stencils and HPC remains underexplored. With the emergence of matrix units on multicore CPUs, we analyze matrix-based…
Most previous 3D IC research focused on stacking traditional 2D silicon layers, so the interconnect reduction is limited to inter-block delays. In this paper, we propose techniques that enable efficient exploration of the 3D design space…
Full spectrum and holospectrum are homogenous information fusion technology developed for the fault diagnosis of rotating machinery, which is extensively exploited in the analysis of the orbits of rotor-bearing systems. However, they are…