Related papers: HeM3D: Heterogeneous Manycore Architecture Based o…
3D holographic communication has the potential to revolutionize the way people interact with each other in virtual spaces, offering immersive and realistic experiences. However, demands for high data rates, extremely low latency, and high…
3D stacked technology has emerged as an effective mechanism to overcome physical limits and communication delays found in 2D integration. However, 3D technology also presents several drawbacks that prevent its smooth application. Two of the…
Neural networks have been applied to the physical layer of wireless communication systems to solve complex problems. In millimeter wave (mmWave) massive multiple-input multiple-output (MIMO) systems, hybrid precoding has been considered as…
Thermally aware design of 2.5D and 3D advanced packaging systems will require fast, accurate, and powerful thermal analysis of chiplets, stacks, and packages. These systems contain multiple materials with non-linear heat transfer properties…
Limited memory bandwidth is a critical bottleneck in modern systems. 3D-stacked DRAM enables higher bandwidth by leveraging wider Through-Silicon-Via (TSV) channels, but today's systems cannot fully exploit them due to the limited internal…
Shape memory structures are playing an important role in many cutting-edge intelligent fields. However, the existing technologies can only realize 4D printing of a single polymer or metal, which limits practical applications. Here, we…
The implementation of Hyperdimensional Computing (HDC) on In-Memory Computing (IMC) architectures faces significant challenges due to the mismatch between highdimensional vectors and IMC array sizes, leading to inefficient memory…
Hybrid analog-digital (A/D) transceivers designed for millimeter wave (mmWave) systems have received substantial research attention, as a benefit of their lower cost and modest energy consumption compared to their fully-digital…
Metal inter-layer via (MIV) in Monolithic three-dimensional integrated circuits (M3D-IC) is used to connect inter-layer devices and provide power and clock signals across multiple layers. The size of MIV is comparable to logic gates because…
This paper presents EMSpice~3, a full-chip multiphysics framework for coupled electromigration (EM), thermomigration (TM), and IR-drop analysis of practical power-grid (P/G) networks. The framework is, to our knowledge, the first EM-IR…
Due to the large bandwidth, low latency and computationally intensive features of virtual reality (VR) video applications, the current resource-constrained wireless and edge networks cannot meet the requirements of on-demand VR delivery. In…
As semiconductor manufacturing advances from the 3-nm process toward the sub-nanometer regime and transitions from FinFETs to gate-all-around field-effect transistors (GAAFETs), the resulting complexity and manufacturing challenges continue…
The growing demands of distributed learning on resource constrained edge devices underscore the importance of efficient on device model compression. Tensor Train Decomposition (TTD) offers high compression ratios with minimal accuracy loss,…
Photonic computing shows promise for transformative advancements in machine learning (ML) acceleration, offering ultra-fast speed, massive parallelism, and high energy efficiency. However, current photonic tensor core (PTC) designs based on…
Three-dimensional (3D)-stacking technology, which enables the integration of DRAM and logic dies, offers high bandwidth and low energy consumption. This technology also empowers new memory designs for executing tasks not traditionally…
Triply periodic minimal surface (TPMS) metamaterials characterized by mathematically-controlled topologies exhibit better mechanical properties compared to uniform structures. The unit cell topology of such metamaterials can be further…
For years, solution processing has provided a versatile platform to extend the applications of transition metal dichalcogenides (TMDs) beyond those achievable with traditional preparation methods. However, existing solution-based synthesis…
Recent embedded systems are designed with high-performance System-on-Chips (SoCs) to satisfy the computational needs of complex applications widely used in real life, such as airplane controllers, autonomous driving automobiles, medical…
The inherent intermittency and high-frequency variability of solar irradiance, particularly during rapid cloud advection, present significant stability challenges to high-penetration photovoltaic grids. Although multimodal forecasting has…
3D video coding is one of the most popular research area in multimedia. This paper reviews the recent progress of the coding technologies for multiview video (MVV) and free view-point video (FVV) which is represented by MVV and depth maps.…