Related papers: HeM3D: Heterogeneous Manycore Architecture Based o…
Monolithic 3D (M3D) technology enables high density integration, performance, and energy-efficiency by sequentially stacking tiers on top of each other. M3D-based network-on-chip (NoC) architectures can exploit these benefits by adopting…
3D-Integration is a promising technology towards higher interconnect densities and shorter wiring lengths between multiple chip stacks, thus achieving a very high performance level combined with low power consumption. This technology also…
Recent nano-technological advances enable the Monolithic 3D (M3D) integration of multiple memory and logic layers in a single chip, allowing for fine-grained connections between layers and significantly alleviating main memory bottlenecks.…
The demand for the three-dimensional (3D) integration of electronic components is on a steady rise. The through-silicon-via (TSV) technique emerges as the only viable method for integrating single-crystalline device components in a 3D…
To continue scaling beyond 2-D CMOS with 3-D integration, any new 3-D IC technology has to be comparable or better than 2-D CMOS in terms of scalability, enhanced functionality, density, power, performance, cost, and reliability.…
3-D integrated circuits (3-D ICs) offer performance advantages due to their increased bandwidth and reduced wire-length enabled by through-silicon-via structures (TSVs). Traditionally TSVs have been considered to improve the thermal…
Monolithic Three-Dimensional Integrated Circuits (M3D-IC) has become an attractive option to increase the transistor density. In M3D-IC, substrate layers are realized on top of previous layers using sequential integration techniques. Recent…
Transformers have revolutionized deep learning and generative modeling to enable unprecedented advancements in natural language processing tasks and beyond. However, designing hardware accelerators for executing transformer models is…
Parallel and monolithic 3D integration directions offer pathways to realize 3D integrated circuits (ICs) but still lead to layer-by-layer implementations, each functional layer being composed in 2D first. This mindset causes challenging…
The rising use of deep learning and other big-data algorithms has led to an increasing demand for hardware platforms that are computationally powerful, yet energy-efficient. Due to the amount of data parallelism in these algorithms,…
3D integration offers key advantages in improving system performance and efficiency for the End-of-Scaling era. It enables the incorporation of heterogeneous system components and disparate technologies, eliminates off-chip communication…
With 3D-stacked DRAM architectures becoming more prevalent, it has become important to find ways to characterize and mitigate the adverse effects that can hinder their inherent access parallelism and throughput. One example of such…
The rising computational demand of modern workloads has renewed interest in energy-efficient paradigms such as neuromorphic and analog computing. A fundamental operation in these systems is matrix-vector multiplication (MVM), ubiquitous in…
For beyond 2-D CMOS logic, various 3-D integration approaches specially transistor based 3-D integrations such as monolithic 3-D [1], Skybridge [2], SN3D [3] holds most promise. However, such 3D architectures within small form factor…
In this work, we proposed a new 3D integration technology: the Flip 3D integration (F3D), consisting of the 3D transistor stacking, the 3D dual-sided interconnects, the 3D die-to-die stacking and the dual-sided Monolithic 3D (M3D). Based on…
As superconducting qubit circuits become more complex, addressing a large array of qubits becomes a challenging engineering problem. Dense arrays of qubits benefit from, and may require, access via the third dimension to alleviate…
Topological materials (TMs) are well-known for their topological protected properties. Phononic system has the advantage of direct observation and engineering of topological phenomena on the macroscopic scale. For the inverse design of 3D…
Two dimensional (2D) integration has been the traditional approach for IC integration. Due to increasing demands for providing electronic devices with superior performance and functionality in more efficient and compact packages, has driven…
3D integration technologies are seeing widespread adoption in the semiconductor industry to offset the limitations and slowdown of two-dimensional scaling. High-density 3D integration techniques such as face-to-face wafer bonding with…
The autoregressive decoding in LLMs is the major inference bottleneck due to the memory-intensive operations and limited hardware bandwidth. 3D-stacked architecture is a promising solution with significantly improved memory bandwidth, which…