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The smart integrated systems of tomorrow would demand a combination of micromechanical components and traditional electronics. On-chip solutions will be the ultimate goal. One way of making such systems is to implement the mechanical parts…
Oxide heterostructures represent a unique playground for triggering the emergence of novel electronic states and for implementing new device concepts. The discovery of 2D conductivity at the $LaAlO_3/SrTiO_3$ interface has been linking for…
Tactile sensing is a crucial perception mode for robots and human amputees in need of controlling a prosthetic device. Today robotic and prosthetic systems are still missing the important feature of accurate tactile sensing. This lack is…
We propose a novel formulation of elastic materials based on high-order interpolants, which fits accurately complex elastic behaviors, but remains conservative. The proposed high-order interpolants can be regarded as a high-dimensional…
The scaling of advanced packaging technologies provides abundant interconnection resources for 2.5D/3D heterogeneous integration (HI), thereby enabling the construction of larger-scale VLSI systems with higher energy efficiency in data…
The fabrication of flexible single-crystalline plasmonic or photonic components in a scalable way is fundamentally important to flexible electronic and photonic devices with high speed, high energy efficiency, and high reliability. However,…
The development of smart textile interfaces is hindered by the inclusion of rigid hardware components and batteries within the fabric, which pose challenges in terms of manufacturability, usability, and environmental concerns related to…
CMOS pixel sensors (CPS) represent a novel technological approach to building charged particle detectors. CMOS processes allow to integrate a sensing volume and readout electronics in a single silicon die allowing to build sensors with a…
There is increasing interest in materials that combine energy-storing functions with augmented mechanical properties, ranging from flexibility in bending to stretchability to structural properties. In the case of lithium-ion batteries,…
Optical metasurfaces (OMSs) have shown unprecedented capabilities for versatile wavefront manipulations at the subwavelength scale, thus opening fascinating perspectives for next generation ultracompact optical devices and systems. However,…
Developments in metamaterials and related structures such as metasurfaces have opened up new possibilities in designing materials and devices with unique properties. The main progress related to electromagnetic waves applications was done…
Recent technological advances in controlling materials have developed methods to produce idealized two-dimensional (2D) electron systems such as heterogeneous interfaces, molecular-beam-epitaxy (MBE) grown atomic layers, exfoliated thin…
Mechanical properties of transition metal dichalcogenides (TMDCs) are relevant to their prospective applications in flexible electronics. So far, the focus has been on the semiconducting TMDCs, mostly MoX2 and WX2 (X=S, Se) due to their…
There are increasing number of works addressing the design challenges of fast, scalable solutions for the growing number of new type of applications. Recently, many of the solutions aimed at improving processing element capabilities to…
Cuprate high temperature superconductors consist of two quasi-two-dimensional (2D) substructures: CuO2 superconducting layers and charge reservoir layers. The superconductivity is realized by charge transfer from the charge reservoir layers…
Junction between metal, superconductor and semiconductor materials seems to be promising for their applications as the electronic devices, microelectronic devices and high power transmission. E-mail [email protected].
High capacity and scalable memory systems play a vital role in enabling our desktops, smartphones, and pervasive technologies like Internet of Things (IoT). Unfortunately, memory systems are becoming increasingly prone to faults. This is…
Ultrathin oxide semiconductors with sub-1-nm thickness are promising building blocks for ultrascaled field-effect transistor (FET) applications due to their resilience against short-channel effects, high air stability, and potential for…
Optical I/O technologies have emerged as a potential industrial solution for high-performance data interconnection in AI/ML computing acceleration. While optical I/Os are deployed at the edge of computational chips by co-packaged optics…
Two-dimensional Indium Selenide (InSe) has attracted extensive attention recently due to its record-high charge carrier mobility and photoresponsivity in the fields of electronics and optoelectronics. Nevertheless, the mechanical properties…