Related papers: Ultra-Stretchable Interconnects for High-Density S…
Programmable and reconfigurable optics hold significant potential for transforming a broad spectrum of applications, spanning space explorations to biomedical imaging, gas sensing, and optical cloaking. The ability to adjust the optical…
For the advancement of highly-integrated stretchable electronics, the development of scalable sub-micrometer conductor patterning is required. Eutectic gallium indium EGaIn is an attractive conductor for stretchable electronics, as its…
Superconductor electronics (SCE) is a promising complementary and beyond CMOS technology. However, despite its practical benefits, the realization of SCE logic faces a significant challenge due to the absence of dense and scalable…
Panel-scale reconfigurable photonic interconnects on a glass substrate up to 500-mm x 500-mm or larger are envisioned by proposing a novel photonic switch fabric that enables all directional panel-edge-to-panel-edge reach without the need…
Soft and flexible conductors are essential in the development of soft robots, wearable electronics, as well as electronic tissue and implants. However, conventional soft conductors are inherently characterized by a large change in…
As computing power demands continue to grow, superconducting electronics present an opportunity to reduce power consumption by increasing the energy efficiency of digital logic and memory. A key milestone for scaling this technology is the…
A maskless post-processing technique for CMOS chips is developed that enables the fabrication of RF MEMS parallel-plate capacitors with a high quality factor and a very compact size. Simulations and measured results are presented for…
Recent reports on machine learning (ML) and machine vision (MV) devices have demonstrated the potentials of 2D materials and devices. Yet, scalable 2D devices are being challenged by contact resistance and Fermi Level Pinning (FLP), power…
Freestanding thin films, a class of low-dimensional materials capable of maintaining structural integrity without substrates, have emerged as a forefront research focus. Their unique advantages-circumventing substrate clamping, liberating…
Large-scale quantum computers with more than $10^5$ qubits will likely be built within the next decade. Trapped ions, semiconductor devices, and superconducting qubits among other physical implementations are still confined in the realm of…
Smart surfaces that reversibly change the interfacial friction coefficients in response to external stimuli enable a wide range of applications, such as grips, seals, brake pads, packaging films, and fabrics. Here a new concept of such a…
Depending on the type of Micro-Electro-Mechanical System (MEMS), packaging costs are contributing up to 80% of the total device cost. Each MEMS device category, its function and operational environment will individually dictate the…
The study of the interactions of living adherent cells with mechanically stable (visco)elastic materials enables understanding and exploiting physiological phenomena mediated by cell-extracellular communication. However, insight on the…
3D die stacking and 2.5D interposer design are promising technologies to improve integration density, performance and cost. Current approaches face serious issues in dealing with emerging security challenges such as side channel attacks,…
Two-dimensional (2D) layered semiconductors, with their ultimate atomic thickness, have shown promise to scale down transistors for modern integrated circuitry. However, the electrical contacts that connect these materials with external…
Many organisms leverage an interplay between shape and activity to generate motion and adapt to their environment. Embedding such feedback into synthetic microrobots could eliminate the need for sensors, software, and actuators, yet current…
Two-dimensional (2D) materials are widely used in various applications due to their extraordinary properties. In particular, their electrochemical stability, low electrical resistance, and huge specific surface area make them very…
The tunable properties of molecular materials place them among the favorites for a variety of future generation devices. In addition, to maintain the current trend of miniaturization of those devices, a departure from the present top-down…
Interfacial deposition stability between Li metal and a solid electrolyte (SE) is important in preventing interfacial contact loss, mechanical fracture, and dendrite growth in Li-metal solid-state batteries (SSB). In this work, we…
Silicon microelectronics, consisting of complementary metal oxide semiconductor (CMOS) technology, have changed nearly all aspects of human life from communication to transportation, entertainment, and healthcare. Despite the widespread and…