Related papers: Ultra-Stretchable Interconnects for High-Density S…
Organic printed electronics has proven its potential as an essential enabler for applications related to healthcare, entertainment, energy and distributed intelligent objects. The possibility of exploiting solution-based and direct-writing…
Micro-scale implantable medical devices (IMDs) extend the immense benefits of sensors used in health management. However, their development is limited by many requirements and challenges, such as the use of safe materials, size…
Driven by the growing demand for large-scale artificial intelligence applications, disaggregated compute nodes and high-radix switches in next-generation computing clusters are set to surpass the capacity of current optical interconnect…
3D printing mechanically flexible composite materials with high electrical conductivity is currently hindered by the need to use high loading of conductive filler, which severely limits flexibility. Here, microstructural patterning of…
Many biological systems can form strong adhesion to various materials with complex shapes. The adhesion is further switchable between strongly adhering and completely non-adhering in a simple and fast manner. By contrast, no engineering…
With advances in exfoliation and synthetic techniques, atomically thin films of semiconducting transition metal dichalcogenides have recently been isolated and characterized. Their two-dimensional structure, coupled with a direct band gap…
High-density polyethylene (HDPE) thin films, while inherently ductile, exhibit poor flaw tolerance. Our experiments show that they fail prematurely not at the point of maximum stretch, but at the boundary of a necked region or notch-tip…
Accurate shape sensing, only achievable through distributed proprioception, is a key requirement for closed-loop control of soft robots. Low-cost power efficient optoelectronic sensors manufactured from flexible materials represent a…
Dielectric metasurfaces are two-dimensional structures composed of nano-scatterers that manipulate phase and polarization of optical waves with subwavelength spatial resolution, enabling ultra-thin components for free-space optics. While…
Flexible transparent electrodes, encompassing the combination of optical transparency and electrical conductivity, empower numerous optoelectronic applications. While the main efforts nowadays concentrate on developing wire meshes and…
Three-dimensional (3D) printing of bioelectronics offers a versatile platform for fabricating personalized and structurally integrated electronic systems within biological scaffolds. Biodegradable electronics, which naturally dissolve after…
Advances in manufacturing techniques may now realize virtually any imaginable microstructures, paving the way for architected materials with properties beyond those found in nature. This has lead to a quest for closing gaps in…
Due to its exceptional dimensional stability in harsh thermal conditions and excellent mechanical and optical properties, Corning ultra-low expansion (ULE) glass is the material of choice in many high-demanding fields such as aerospace,…
Complementary-metal-oxide-semiconductor (CMOS) is the most widely spread technology for integrated circuits fabrication. Each foundry offers different technology nodes that are characterized by the minimum feature size, which is the…
This work reports flexible fully transparent high-voltage diodes that feature high rectification ratio (Rr 10 8) and high breakdown voltage (Vb 150 V) simultaneously, combined with their applications as building blocks of energy management…
We study the effect of intersegment interactions on the effective bending and stretching moduli of a semiflexible polymer chain with a finite stretching modulus. For an interaction potential of a screened Debye-H\" uckel type…
Two-dimensional materials (2DM) and their derived heterostructures have electrical and optical properties that are widely tunable via several approaches, most notably electrostatic gating and interfacial engineering such as twisting. While…
At sub-20nm technologies CMOS scaling faces severe challenges primarily due to fundamental device scaling limitations, interconnection overhead and complex manufacturing. Migration to 3D has been long sought as a possible pathway to…
Quality of the electrical contacts and interfaces in various metal/semiconductor/insulator heterostructures is one of the pivotal aspects in both applied and fundamental research areas. For instance, non-optimal contact resistance can limit…
Robust nanoporous polymer films with approximate 100-nm thicknesses would be broadly applicable in technological areas such as flexible sensors, artificial skins, separators, antireflection and self-cleaning films. However, the creation of…