Related papers: Ultra-Stretchable Interconnects for High-Density S…
Deployable structures, essential across various engineering applications ranging from umbrellas to satellites, are evolving to include soft, morphable designs where geometry drives transformation. However, a major challenge for soft…
As designs for superconducting qubits become more complex, 3D integration of two or more vertically bonded chips will become necessary to enable increased density and connectivity. Precise control of the spacing between these chips is…
The mechanical stretchability is the magnitude of strain which a material can suffer before it breaks. Materials with high mechanical stretchability, which can reversibly withstand extreme mechanical deformation and cover arbitrary surfaces…
A new type of integrated polarizer based on bent coupled optical waveguides is proposed. The simplicity of the device geometry permits its realization using only basic standard fabrication steps. A deep etched waveguide silicon nitride…
The discovery of high-temperature superconductivity in FeSe/SrTiO3 has sparked significant interests in exploring new superconducting systems with engineered interfaces. Here, using molecular beam epitaxy growth, we successfully fabricate…
Over the past several years, the inherent scaling limitations of electron devices have fueled the exploration of high carrier mobility semiconductors as a Si replacement to further enhance the device performance. In particular, compound…
Continuous scaling of CMOS has been the major catalyst in miniaturization of integrated circuits (ICs) and crucial for global socio-economic progress. However, scaling to sub-20nm technologies is proving to be challenging as MOSFETs are…
Soft materials capable of large inelastic deformation play an essential role in high-performance nacre-inspired architectured materials with a combination of stiffness, strength and toughness. The rigid "building blocks" made from glass or…
This paper explores the potential of cryogenic semiconductor computing and superconductor electronics as promising alternatives to traditional semiconductor devices. As semiconductor devices face challenges such as increased leakage…
As silicon transistors scale toward future technology nodes, three-dimensional architectures -- including gate-all-around (GAA) nanoribbon and complementary field-effect transistors (CFETs) -- require channel widths in the tens of…
Two-dimensional (2D) material heterostructures have attracted considerable attention owing to their interesting and novel physical properties, which expand the possibilities for future optoelectronic, photovoltaic, and nanoelectronic…
Consumer-level multi-material 3D printing with conductive thermoplastics enables fabrication of interactive elements for bespoke tangible devices. However, large feature sizes, high resistance materials, and limitations of printable control…
Superconductor Electronics (SCE) is a fast and power-efficient technology with great potential for overcoming conventional CMOS electronics' scaling limits. Nevertheless, the primary challenge confronting SCE today pertains to its…
Interconnect resistance and reliability have emerged as critical factors limiting the performance of advanced CMOS circuits. With the slowdown of transistor scaling, interconnect scaling has become the primary driver of continued circuit…
Freestanding oxide membranes offer integration with advanced semiconductor platforms, unlocking opportunities for flexible electronics, silicon-based spintronics, neuromorphic computing, and high-performance energy technologies. Scalable…
In recent years, interfacial fracture becomes one of the most important problems in the assessment of reliability of electronics packaging. Especially, underfill resin is used with solder joints in flip chip packaging for preventing the…
Microelectromechanical systems (MEMS) can offer a competitive alternative for conventional technology in electrical precision measurements. This article summarises recent work in development of MEMS solutions for electrical metrology.…
Modular architectures are a promising approach to scale quantum devices to the point of fault tolerance and utility. Modularity is particularly appealing for superconducting qubits, as monolithically manufactured devices are limited in both…
Friction dissipates a substantial portion of global energy, motivating the pursuit of superlubricity, a state of near-zero friction, in real-world systems. Conventional approaches rely on crystalline lattice mismatch to suppress periodic…
Modular microrobotics can potentially address many information-intensive microtasks in medicine, manufacturing and the environment. However, surface area has limited the natural powering, communication, functional integration, and…