Ultrathin oxide freestanding membranes with large-scale continuity and structural perfection

Freestanding oxide membranes offer integration with advanced semiconductor platforms, unlocking opportunities for flexible electronics, silicon-based spintronics, neuromorphic computing, and high-performance energy technologies. Scalable fabrication of such membranes is essential for bridging fundamental discoveries in complex oxides with practical device deployment. However, the lateral dimensions of crack- and wrinkle-free membranes remain limited to millimeter scales, forming a critical bottleneck for large-area architectures. Overcoming this challenge demands strategies that preserve crystalline quality while suppressing defect transfer during release. Here, we demonstrate an approach based on a water-soluble sacrificial layer of super-tetragonal Sr4Al2O7, enabling the fabrication of ultrathin, crack-free, and wrinkle-free free-standing oxide membranes spanning centimeter-scale areas. This method is broadly applicable to a wide range of oxides and establishes a new pathway toward large-scale silicon integration and flexible oxide technologies. Nevertheless, dissolution of the sacrificial layer introduces oxygen vacancies into the SrRuO3 membranes, with diffusion depths reaching six unit cells, leading to anomalous "up-and-down" transport behavior. Although post-annealing can eliminate these vacancies, the required temperatures are incompatible with CMOS processes. Therefore, ultrathin freestanding membranes fabricated by water-assisted lift-off still face critical challenges for integration into miniaturized silicon-based oxide devices.